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TND012MP

Onsemi

TND012MP by Onsemi

TND012MP by Onsemi is a Peripheral Driver with 3 terminals, operating from -40 to 150 °C. Its plastic/epoxy body makes it suitable for automotive applications due to its terminal pitch of 2.54mm and single terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,240 parts In-Stock

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1,240

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Vyrian

USA . 1,027 parts In-Stock

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1,027

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 6,812 parts In-Stock

1+ parts

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6,812

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Problanco Electronics

Mexico . 4,802 parts In-Stock

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4,802

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Corphita

USA . 1,069 parts In-Stock

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1,069

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TANS Electronics

Latvia . 853 parts In-Stock

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853

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UHIMA Technologies

Türkiye . 822 parts In-Stock

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822

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Corohmni

South Africa . 219 parts In-Stock

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219

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SupplyDigital Components

Austria . 115 parts In-Stock

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Overview

Unlock the potential of your automotive applications with the TND012MP by Onsemi. As a leader in peripheral drivers, Onsemi ensures top-notch quality and reliability in every product. The TND012MP offers seamless integration, efficient performance, and unparalleled value to customers looking to enhance their automotive systems. Trust Onsemi to deliver cutting-edge solutions that drive innovation and power your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications where weight and durability are important.

No. of Terminals: 3

Having 3 terminals allows for easy connection to other components, making installation and wiring simpler and more efficient.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures the product can withstand heat and operate reliably in challenging automotive environments.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the product is suitable for use in cold climates or during winter, ensuring consistent performance in various conditions.

Terminal Position: SINGLE

The single terminal position simplifies the installation process and reduces the chances of errors, making it user-friendly for technicians and DIY enthusiasts.

Temperature Grade: AUTOMOTIVE

Being designed for automotive applications, the product meets the necessary temperature requirements and standards for safe and reliable operation in vehicles.

Terminal Pitch: 2.54 mm

The standardized terminal pitch of 2.54 mm ensures compatibility with a wide range of connectors and sockets, allowing for easy integration into existing systems.

Technical Specifications

Peripheral Drivers TND012MP attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP3,.048

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

NO

Temperature Grade:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

TND012MP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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