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TND017SW-TL-E

Onsemi

TND017SW-TL-E by Onsemi

TND017SW-TL-E by Onsemi is a peripheral driver with 1.5V power supply, 8 terminals, and operates in temperatures from -40 to 85 °C. It features GULL WING terminals, SMALL OUTLINE package style, and is ideal for industrial applications requiring a compact rectangular package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,346 parts In-Stock

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Digiode

USA . 173 parts In-Stock

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AZTECH Wire

Italy . 461 parts In-Stock

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$10.130

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461

$10.130

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Component Stockers USA

USA . 253 parts In-Stock

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$99.990

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253

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Problanco Electronics

Mexico . 7,167 parts In-Stock

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SupplyDigital Components

Austria . 5,216 parts In-Stock

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TANS Electronics

Latvia . 4,810 parts In-Stock

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Kulean Microsystems

USA . 4,073 parts In-Stock

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Corphita

USA . 1,967 parts In-Stock

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UHIMA Technologies

Türkiye . 468 parts In-Stock

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468

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Microchip USA

USA . 332 parts In-Stock

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Corohmni

South Africa . 187 parts In-Stock

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Overview

Unlock a world of possibilities with the TND017SW-TL-E by Onsemi. This high-quality peripheral driver offers unparalleled performance and reliability, thanks to Onsemi's reputation as a leading manufacturer in the industry. Perfect for a wide range of applications, this product is designed to meet the needs of customers looking for value and innovation. Experience the benefits of seamless integration, superior efficiency, and unmatched durability with the TND017SW-TL-E - the perfect choice for all your driving needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it easy to handle and ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular package shape ensures easy placement and secure mounting on the circuit board, contributing to a more organized and efficient design layout.

Power Supplies (V): 1.5

The low power supply voltage requirement of 1.5V ensures energy efficiency and compatibility with various systems and applications.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for multiple connections, enhancing the versatility of the product.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is ideal for compact designs, making the product suitable for applications where size constraints are a consideration.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can function reliably even in high-temperature environments, ensuring consistent performance under challenging conditions.

Minimum Operating Temperature: -40 °C

The product can operate effectively at low temperatures as well, down to -40 °C, making it suitable for a wide range of operating environments and conditions.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The use of tin/bismuth terminal finish provides a stable and reliable connection, ensuring excellent conductivity and long-term performance.

Terminal Position: DUAL

Having dual terminal positions allows for increased flexibility in circuit board layout and connection options, accommodating different designs and configurations.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand harsh industrial environments and operate reliably under demanding conditions.

Terminal Form: GULL WING

The gull wing terminal form offers secure attachment to the circuit board and enables easy soldering, ensuring a robust and reliable connection.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5V is well-suited for low-power applications and ensures efficient operation with minimal power consumption.

Terminal Pitch: 1.27 mm

The narrow terminal pitch of 1.27mm allows for high-density mounting and precise placement on the circuit board, enabling compact and efficient designs.

Driver No. of Bits: 4

The 4 bits driver configuration provides sufficient resolution and control for various applications, offering versatility and precision in driving peripheral devices.

Technical Specifications

Peripheral Drivers TND017SW-TL-E attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1.5

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TND017SW-TL-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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