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TND027MP

Onsemi

TND027MP by Onsemi

TND027MP by Onsemi is a MOS peripheral driver with 3 terminals. It operates in industrial temperature range (-40 to 85 °C) and supports a max output current of 1.5A. This PLASTIC/EPOXY packaged driver is ideal for various applications requiring precise control and efficient power management.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,036 parts In-Stock

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Vyrian

USA . 2,014 parts In-Stock

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2,014

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Distributors (Availability)

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Problanco Electronics

Mexico . 8,194 parts In-Stock

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8,194

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Kulean Microsystems

USA . 4,445 parts In-Stock

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4,445

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TANS Electronics

Latvia . 2,790 parts In-Stock

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2,790

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SupplyDigital Components

Austria . 1,642 parts In-Stock

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Corphita

USA . 616 parts In-Stock

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616

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Corohmni

South Africa . 408 parts In-Stock

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UHIMA Technologies

Türkiye . 133 parts In-Stock

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Overview

Enhance your electronic designs with the reliable and high-quality TND027MP peripheral driver by Onsemi. Known for its superior manufacturing standards, Onsemi delivers unmatched performance in the field of semiconductor technology. This versatile product is ideal for a wide range of applications, offering customers unparalleled value and benefits. Whether you're looking to enhance your industrial equipment or boost the efficiency of your automotive systems, the TND027MP is the perfect solution for all your peripheral driver needs. Elevate your projects with Onsemi's cutting-edge technology and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a variety of applications.

No. of Terminals: 3

Having 3 terminals provides flexibility in connecting the driver to other components, allowing for versatile usage.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this driver can withstand demanding environments without overheating.

Minimum Operating Temperature: -40 °C

Being able to operate at low temperatures makes this driver suitable for use in a wide range of environments, including industrial settings.

Terminal Finish: Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

The use of multiple finishes provides good conductivity and corrosion resistance, ensuring reliable connections and longevity.

Technology: MOS

MOS technology offers high efficiency and low power consumption, making this driver energy-efficient and reliable for long-term use.

Maximum Output Current: 1.5 A

The high maximum output current allows this driver to power components that require higher current levels, making it versatile and capable.

Terminal Pitch: 1.27 mm

The narrow terminal pitch provides precise and secure connections, ideal for applications where space is limited and accuracy is crucial.

Technical Specifications

Peripheral Drivers TND027MP attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

JESD-609 Code:

e2

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP3,.1,50

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Trade Compliance

TND027MP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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