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SMMBF4391LT1G

Onsemi

SMMBF4391LT1G by Onsemi

SMMBF4391LT1G by Onsemi is a N-CHANNEL FET for SWITCHING applications. It features a 30V DS Breakdown Voltage, 3.5pF Crss, and -55 to 150 °C operating temperature range. This SMALL OUTLINE transistor with GULL WING terminals is ideal for DEPLETION MODE operation in various electronic circuits.

Median Price

$0.291

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30,201 parts In-Stock

1+ parts

-

100+ parts

$0.291

1k+ parts

$0.241

10k+ parts

$0.215

30,201

-

$0.291

$0.241

$0.215

DigiKey

USA . 30,201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.360

10k+ parts

-

30,201

-

-

$0.360

-

Verical

USA . 30,201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.269

30,201

-

-

-

$0.269

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 85 parts In-Stock

1+ parts

$0.213

100+ parts

-

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85

$0.213

-

-

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Digiode

USA . 605 parts In-Stock

1+ parts

$0.226

100+ parts

-

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605

$0.226

-

-

-

Chip Stock

USA . 47,000 parts In-Stock

1+ parts

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47,000

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DigiKey Marketplace

USA . 30,201 parts In-Stock

1+ parts

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30,201

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Vyrian

USA . 4,233 parts In-Stock

1+ parts

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4,233

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-

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Distributors (Availability)

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Semicontronic

India . 30,148 parts In-Stock

1+ parts

$0.184

100+ parts

$0.179

1k+ parts

$0.178

10k+ parts

-

30,148

$0.184

$0.179

$0.178

-

Ampacity Inc.

Singapore . 29,984 parts In-Stock

1+ parts

$0.184

100+ parts

-

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29,984

$0.184

-

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Corohmni

South Africa . 111 parts In-Stock

1+ parts

$0.208

100+ parts

-

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111

$0.208

-

-

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Argo Parts USA

USA . 4,588 parts In-Stock

1+ parts

$0.213

100+ parts

-

1k+ parts

-

10k+ parts

$0.206

4,588

$0.213

-

-

$0.206

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.213

100+ parts

$0.208

1k+ parts

-

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100

$0.213

$0.208

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Corphita

USA . 816 parts In-Stock

1+ parts

$0.214

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-

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816

$0.214

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Aztec Data Supply Inc.

USA . 2,989 parts In-Stock

1+ parts

$0.899

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-

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2,989

$0.899

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AZTECH Wire

Italy . 353 parts In-Stock

1+ parts

$14.820

100+ parts

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353

$14.820

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Continental Prestige Electronics

USA . 30,201 parts In-Stock

1+ parts

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100+ parts

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$0.188

10k+ parts

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30,201

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$0.188

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Kulean Microsystems

USA . 6,929 parts In-Stock

1+ parts

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6,929

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TANS Electronics

Latvia . 5,279 parts In-Stock

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5,279

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SupplyDigital Components

Austria . 3,783 parts In-Stock

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3,783

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Problanco Electronics

Mexico . 2,284 parts In-Stock

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2,284

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UHIMA Technologies

Türkiye . 620 parts In-Stock

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620

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Overview

Experience superior performance and reliability with the SMMBF4391LT1G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-quality Small Signal Field Effect Transistors (FET) that are perfect for switching applications. With a minimum DS breakdown voltage of 30V and maximum power dissipation of 0.225W, this N-channel transistor offers unparalleled efficiency and durability. Whether you're designing consumer electronics or automotive systems, this depletion-mode transistor in a small outline package provides the optimal solution for your needs. Trust Onsemi for cutting-edge technology and unbeatable value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components and ensures durability.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching applications.

Configuration: SINGLE

Simplified design and easy integration.

Transistor Application: SWITCHING

Optimized for fast switching operations.

Surface Mount: YES

Suitable for compact and automated assembly processes.

Minimum DS Breakdown Voltage: 30 V

Provides a good margin of safety for various applications.

Package Shape: RECTANGULAR

Efficient use of space and easy to handle.

Terminal Form: GULL WING

Facilitates easy soldering and secure connections.

Operating Mode: DEPLETION MODE

Allows for control of current flow when the gate voltage is zero.

No. of Terminals: 3

Simplified connections and reduced complexity.

Maximum Power Dissipation (Abs): 0.225 W

Suitable for low to medium power applications.

Package Style (Meter): SMALL OUTLINE

Saves space and enables high component density on PCB.

Field Effect Transistor Technology: JUNCTION

Provides good performance and reliability in various operating conditions.

Maximum Operating Temperature: 150 °C

Can withstand high temperature environments.

Transistor Element Material: SILICON

Offers good electrical properties and compatibility with most circuit designs.

Minimum Operating Temperature: -55 °C

Suitable for operation in extreme cold conditions.

Terminal Finish: TIN

Ensures good conductivity for reliable connections.

Maximum Drain-Source On Resistance: 30 ohm

Provides low resistance for efficient current flow.

Terminal Position: DUAL

Facilitates easier PCB layout and routing considerations.

Peak Reflow Temperature °C: 260

Can withstand high temperature soldering processes.

Maximum Feedback Capacitance (Crss): 3.5 pF

Low capacitance for minimal impact on high-frequency performance.

Reference Standard: AEC-Q101

Complies with automotive industry quality and reliability standards.

Technical Specifications

Small Signal Field Effect Transistors (FET) SMMBF4391LT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain-Source On Resistance:

30 ohm

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

3.5 pF

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SMMBF4391LT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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