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SMMBF0202PLT1

Onsemi

SMMBF0202PLT1 by Onsemi

SMMBF0202PLT1 by Onsemi is a P-CHANNEL FET with 20V DS breakdown voltage, 0.3A ID, and 1.4Ω RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package suitable for surface mount technology.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 600 parts In-Stock

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600

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Vyrian

USA . 487 parts In-Stock

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487

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Kulean Microsystems

USA . 7,979 parts In-Stock

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TANS Electronics

Latvia . 6,664 parts In-Stock

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Problanco Electronics

Mexico . 5,999 parts In-Stock

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SupplyDigital Components

Austria . 4,726 parts In-Stock

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Corphita

USA . 2,223 parts In-Stock

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UHIMA Technologies

Türkiye . 423 parts In-Stock

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Corohmni

South Africa . 385 parts In-Stock

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Overview

Discover the cutting-edge SMMBF0202PLT1 by Onsemi, a top-tier manufacturer renowned for quality products. This P-CHANNEL Small Signal Field Effect Transistor with built-in diode is ideal for switching applications, offering enhanced performance and reliability. With a low drain-source resistance of 1.4 ohms and a minimum breakdown voltage of 20V, this transistor ensures maximum efficiency. Upgrade your electronics with the SMMBF0202PLT1 and experience unparalleled value and benefits in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the transistor lightweight and durable, ideal for applications where weight and size are critical factors.

Polarity or Channel Type: P-CHANNEL

P-channel FETs typically have higher electron mobility and lower leakage currents, which can result in better performance and efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by providing protection against reverse voltage spikes, making this transistor a convenient choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low power consumption, making it efficient and reliable in various circuit designs.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and costs during production.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltages, offering a wider range of applications and increased reliability.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor and easy integration into existing circuit designs, offering compatibility and ease of use.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and secure connections, ensuring the reliability and longevity of the transistor in various operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer the advantage of being normally off, providing better control over the circuit and reduced power consumption in standby mode.

No. of Terminals: 3

With 3 terminals, this transistor is easy to integrate into circuit designs and offers flexibility in connection options for different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and applications where size constraints are a concern.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good performance characteristics such as high input impedance and low power consumption, making this transistor efficient and reliable in operation.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its high performance and reliability, making this transistor a durable and efficient choice for various applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and conductivity, ensuring reliable connections and easy assembly during production.

Maximum Drain Current (ID): 0.3 A

With a maximum drain current of 0.3A, this transistor can handle moderate current loads, making it suitable for low to medium power applications.

Maximum Drain-Source On Resistance: 1.4 ohm

The low drain-source on resistance of 1.4 ohms ensures efficient power transfer and minimal voltage drop across the transistor, resulting in high performance in switching applications.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in circuit design and layout, allowing for convenient connection options and adaptability to various mounting configurations.

Technical Specifications

Small Signal Field Effect Transistors (FET) SMMBF0202PLT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

.3 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SMMBF0202PLT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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