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P2I2304NZF-08-TR

Onsemi

P2I2304NZF-08-TR by Onsemi

P2I2304NZF-08-TR by Onsemi is Clock Drivers & Buffers with 8 terminals, 3.3V supply voltage, and 5ns propagation delay. Ideal for industrial applications, it operates b/w -40 to 85 °C with a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,828 parts In-Stock

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Digiode

USA . 581 parts In-Stock

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AZTECH Wire

Italy . 677 parts In-Stock

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$13.430

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677

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QUARKTWIN TECHNOLOGY LTD

USA . 17,318 parts In-Stock

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SupplyDigital Components

Austria . 5,827 parts In-Stock

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Kulean Microsystems

USA . 4,926 parts In-Stock

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Corphita

USA . 1,967 parts In-Stock

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TANS Electronics

Latvia . 1,776 parts In-Stock

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Problanco Electronics

Mexico . 561 parts In-Stock

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Microchip USA

USA . 372 parts In-Stock

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Corohmni

South Africa . 294 parts In-Stock

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UHIMA Technologies

Türkiye . 216 parts In-Stock

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Overview

Unlock the power of precision timing with the P2I2304NZF-08-TR clock driver by Onsemi. Designed for reliability and performance, this small outline rectangular package is perfect for a wide range of applications. With standard input conditioning and a nominal supply voltage of 3.3V, this clock driver offers fast propagation delay and dual terminal position for seamless integration. Whether you're looking to enhance your industrial automation systems or optimize your communication networks, the P2I2304NZF-08-TR provides the quality and value you need to stay ahead of the competition. Elevate your projects with Onsemi's superior clock drivers and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring a long lifespan.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V makes this product compatible with a wide range of systems and applications.

Propagation Delay (tpd): 5 ns

With a low propagation delay of 5ns, this clock driver & buffer ensures efficient signal transmission in high-speed applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows this product to function reliably in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the product can operate in a wide range of temperature environments.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for versatile integration into different circuit designs.

Terminal Finish: TIN

The tin terminal finish offers good conductivity and solderability, ensuring secure connections and reliable performance.

Width: 3 mm

The compact width of 3mm makes this product suitable for space-constrained applications and PCB layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets the stringent requirements for reliability and performance in industrial settings.

Technical Specifications

Clock Drivers & Buffers P2I2304NZF-08-TR attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2304

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

5 ns

Maximum Same Edge Skew (tskwd):

.15 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

P2I2304NZF-08-TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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