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P2I2304NZF-08TT

Onsemi

P2I2304NZF-08TT by Onsemi

P2I2304NZF-08TT clock driver by Onsemi features 5ns propagation delay, 3.3V nominal voltage, and -40 to 85 °C operating temperature range. Ideal for applications requiring precise timing control in industrial settings with its small outline package style and standard input conditioning.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,764 parts In-Stock

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Digiode

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TANS Electronics

Latvia . 7,943 parts In-Stock

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Kulean Microsystems

USA . 6,721 parts In-Stock

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Problanco Electronics

Mexico . 4,776 parts In-Stock

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Corphita

USA . 1,521 parts In-Stock

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SupplyDigital Components

Austria . 1,100 parts In-Stock

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UHIMA Technologies

Türkiye . 303 parts In-Stock

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Corohmni

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Overview

Enhance the performance of your electronic devices with the P2I2304NZF-08TT clock driver and buffer by Onsemi. With a reputation for top-quality products, Onsemi delivers reliability and precision in every component. Designed for industrial applications, this small-outline, thin-profile package offers fast signal propagation and dual terminal positions for optimal functionality. Upgrade your systems with the P2I2304NZF-08TT and experience seamless operation, precise timing, and unmatched efficiency. Trust Onsemi for cutting-edge technology that takes your devices to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Surface Mount: YES

Ease of installation and space-saving design for compact electronic devices.

Input Conditioning: STANDARD

Ensures compatibility with a wide range of input signals and devices.

Nominal Supply Voltage: 3.3V

Optimal voltage level for consistent and reliable performance.

Propagation Delay: 5 ns

Fast signal propagation for precise timing and synchronization in clocking applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

Terminal Form: GULL WING

Easy soldering and secure connection to the circuit board.

No. of True Outputs: 4

Provides multiple output options for versatile clocking requirements.

Technical Specifications

Clock Drivers & Buffers P2I2304NZF-08TT attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

2304

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

5 ns

Maximum Same Edge Skew (tskwd):

.15 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

P2I2304NZF-08TT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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