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P2I2305NZG-08ST

Onsemi

P2I2305NZG-08ST by Onsemi

P2I2305NZG-08ST clock driver by Onsemi features 8 terminals, 6ns propagation delay, and operates at -40 to 85 °C. Ideal for industrial applications requiring a small outline package with gull wing terminals and standard input conditioning.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 799 parts In-Stock

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Vyrian

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TANS Electronics

Latvia . 5,303 parts In-Stock

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Problanco Electronics

Mexico . 4,958 parts In-Stock

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SupplyDigital Components

Austria . 4,705 parts In-Stock

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Kulean Microsystems

USA . 3,923 parts In-Stock

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Corphita

USA . 1,633 parts In-Stock

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Corohmni

South Africa . 411 parts In-Stock

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UHIMA Technologies

Türkiye . 114 parts In-Stock

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Overview

Discover the power of precision with the P2I2305NZG-08ST by Onsemi. As a leading manufacturer in clock drivers & buffers, Onsemi delivers unparalleled quality and reliability in every product. This compact yet powerful device offers customers seamless integration, low propagation delay, and wide operating temperature range for industrial-grade applications. Say goodbye to compatibility issues and hello to efficient performance with the P2I2305NZG-08ST. Elevate your projects with Onsemi's innovative solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the clock driver/buffer, making it suitable for various operating environments.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Propagation Delay (tpd): 6 ns

Low propagation delay ensures fast signal transmission, making the clock driver/buffer efficient in time-sensitive applications.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, ensuring reliability and stability in harsh conditions.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement allows for compatibility with a wide range of systems and power sources.

Technical Specifications

Clock Drivers & Buffers P2I2305NZG-08ST attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

P2

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.91 mm

Trade Compliance

P2I2305NZG-08ST Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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