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P2I2309NZG-16-ST

Onsemi

P2I2309NZG-16-ST by Onsemi

P2I2309NZG-16-ST by Onsemi is a Clock Driver with 6ns Propagation Delay, 3.3V Supply Voltage, and 100MHz fmax. Ideal for industrial applications requiring fast signal processing in compact designs due to its small outline package and standard input conditioning.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,324 parts In-Stock

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Vyrian

USA . 625 parts In-Stock

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Problanco Electronics

Mexico . 8,031 parts In-Stock

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Kulean Microsystems

USA . 5,972 parts In-Stock

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Corphita

USA . 1,987 parts In-Stock

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SupplyDigital Components

Austria . 775 parts In-Stock

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Corohmni

South Africa . 224 parts In-Stock

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TANS Electronics

Latvia . 68 parts In-Stock

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UHIMA Technologies

Türkiye . 66 parts In-Stock

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Overview

Enhance your electronic designs with the P2I2309NZG-16-ST clock drivers & buffers from Onsemi. With a reputation for superior quality and reliability, Onsemi delivers cutting-edge solutions for a wide range of applications. This compact, surface-mount package offers fast propagation delay at a nominal supply voltage of 3.3V, providing optimal performance in industrial settings. Trust Onsemi to provide you with the value, benefits, and advantages you need to bring your projects to life. Choose the P2I2309NZG-16-ST for seamless integration and unparalleled efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand the rigors of daily use, making the product long-lasting.

Propagation Delay At Nominal Supply: 6 ns

The low propagation delay ensures that the clock signals are accurately distributed without any significant delay.

Surface Mount: YES

The surface mount feature makes installation easy and saves valuable PCB space.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard supply voltages, ensuring ease of integration into existing systems.

Maximum I (ol): 12 Amp

The high maximum output current ensures that the device can drive multiple loads effectively.

Maximum Operating Temperature: 85 °C

Operates efficiently even in high-temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

Can function in low-temperature conditions without any issues, suitable for a wide range of applications.

No. of True Outputs: 9

Multiple true outputs provide flexibility in connecting to different components or systems.

Minimum fmax: 100 MHz

High maximum frequency ensures compatibility with modern high-speed systems.

Technical Specifications

Clock Drivers & Buffers P2I2309NZG-16-ST attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

S

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

100 MHz

Trade Compliance

P2I2309NZG-16-ST Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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