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NVTFS015P03P8ZTAG

Onsemi

NVTFS015P03P8ZTAG by Onsemi

NVTFS015P03P8ZTAG by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 353A IDM and 88mJ EAS, suitable for high-power operations. With -55 to 175 °C operating range and AEC-Q101 standard, it ensures reliable performance in automotive environments.

Median Price

$0.444

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 670 parts In-Stock

1+ parts

-

100+ parts

$0.444

1k+ parts

$0.368

10k+ parts

$0.328

670

-

$0.444

$0.368

$0.328

Distributors (In-Stock)

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Flip Electronics

USA . 6,000 parts In-Stock

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Vyrian

USA . 4,780 parts In-Stock

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Digiode

USA . 2,202 parts In-Stock

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Component Stockers USA

USA . 8,112 parts In-Stock

1+ parts

$4.630

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$4.630

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AZTECH Wire

Italy . 1,070 parts In-Stock

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$20.890

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$20.890

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TANS Electronics

Latvia . 6,707 parts In-Stock

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6,707

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Problanco Electronics

Mexico . 6,506 parts In-Stock

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Kulean Microsystems

USA . 3,859 parts In-Stock

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3,859

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SupplyDigital Components

Austria . 2,742 parts In-Stock

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Corphita

USA . 1,755 parts In-Stock

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UHIMA Technologies

Türkiye . 410 parts In-Stock

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Corohmni

South Africa . 50 parts In-Stock

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Overview

Discover the NVTFS015P03P8ZTAG by Onsemi, a top-quality Power FET perfect for various switching applications. With its P-CHANNEL configuration and built-in diode, this transistor offers enhanced performance and reliability. Ideal for power management in automotive, industrial, and consumer electronics, this product boasts a high operating temperature range and low on-resistance for maximum efficiency. Trust Onsemi's reputation for excellence and experience the value of superior technology with the NVTFS015P03P8ZTAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protects the internal components of the FET, ensuring long-term reliability.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage allows for reliable operation even in high voltage applications, making it a versatile choice for various circuits.

Maximum Power Dissipation (Abs): 88.2 W

With a high power dissipation rating, this FET can handle large loads and prevent overheating, ensuring stable performance under heavy usage.

Maximum Drain Current (ID): 17 A

The high drain current capability allows the FET to handle high current loads without any issues, making it suitable for power switching applications.

Maximum Drain-Source On Resistance: 0.0075 ohm

The low on resistance ensures efficient power transfer and minimal power loss, making the FET energy-efficient and ideal for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS015P03P8ZTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

88 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.0075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

875 pF

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

353 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVTFS015P03P8ZTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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