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NVMFS6H858NT1G

Onsemi

NVMFS6H858NT1G by Onsemi

NVMFS6H858NT1G by Onsemi is a Power FET with 80V DS Breakdown Voltage, 137A IDM, and 0.0207 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance. Enhances performance in power management systems with its high current and low resistance capabilities.

Median Price

$2.950

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,400 parts In-Stock

1+ parts

$2.950

100+ parts

$1.330

1k+ parts

$1.030

10k+ parts

$1.020

1,400

$2.950

$1.330

$1.030

$1.020

DigiKey

USA . 840 parts In-Stock

1+ parts

$2.950

100+ parts

$1.320

1k+ parts

$1.096

10k+ parts

$0.896

840

$2.950

$1.320

$1.096

$0.896

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 10,500 parts In-Stock

1+ parts

-

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10,500

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Vyrian

USA . 4,895 parts In-Stock

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4,895

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Digiode

USA . 1,218 parts In-Stock

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1,218

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Distributors (Availability)

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Microchip USA

USA . 187 parts In-Stock

1+ parts

$7.158

100+ parts

-

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187

$7.158

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Component Stockers USA

USA . 5,720 parts In-Stock

1+ parts

$11.820

100+ parts

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5,720

$11.820

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TANS Electronics

Latvia . 7,243 parts In-Stock

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7,243

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Problanco Electronics

Mexico . 6,094 parts In-Stock

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6,094

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SupplyDigital Components

Austria . 5,747 parts In-Stock

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5,747

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,384 parts In-Stock

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1,384

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Corohmni

South Africa . 364 parts In-Stock

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364

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UHIMA Technologies

Türkiye . 336 parts In-Stock

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336

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Kulean Microsystems

USA . 23 parts In-Stock

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Overview

Unleash the power of innovation with the NVMFS6H858NT1G by Onsemi, a leading manufacturer in the field of Power Field Effect Transistors (FET). This N-CHANNEL transistor offers unparalleled quality and reliability with its single configuration and built-in diode, making it perfect for a wide range of applications. From industrial automation to automotive systems, this transistor ensures optimal performance and efficiency. Experience the value and benefits of this product, from its high maximum drain current to its low on resistance, providing customers with a superior solution for their power management needs. Elevate your projects with Onsemi's NVMFS6H858NT1G and discover the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL design allows for efficient power handling and operation in a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and enhances functionality for various power handling needs.

Surface Mount: YES

Facilitates easy installation and compact integration into circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape enables efficient placement and secure mounting in electronic devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers precise control over power flow and enhances overall performance.

Maximum Pulsed Drain Current (IDM): 137 A

High maximum pulsed drain current ensures reliable and efficient power handling under peak load conditions.

Avalanche Energy Rating (EAS): 151 mJ

High avalanche energy rating provides added protection against voltage spikes and surges, improving device reliability.

Maximum Drain Current (Abs) (ID): 29 A

Suitable maximum drain current rating for various power applications, ensuring stable operation within specified limits.

Maximum Power Dissipation (Abs): 42 W

High power dissipation capability enables efficient heat management and prolonged device lifespan.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS6H858NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

151 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

29 A

Maximum Drain Current (ID):

29 A

Maximum Drain-Source On Resistance:

.0207 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

4.7 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

137 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS6H858NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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