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NVMFS6B14NT1G

Onsemi

NVMFS6B14NT1G by Onsemi

NVMFS6B14NT1G by Onsemi is a Power FET with N-CHANNEL polarity, 100V DS breakdown voltage, and 140A max pulsed drain current. Ideal for applications requiring high power dissipation in small outline packages, such as automotive electronics and industrial control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,224 parts In-Stock

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Digiode

USA . 1,359 parts In-Stock

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AZTECH Wire

Italy . 78 parts In-Stock

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$12.720

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Component Stockers USA

USA . 662 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 7,553 parts In-Stock

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TANS Electronics

Latvia . 7,492 parts In-Stock

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Kulean Microsystems

USA . 7,367 parts In-Stock

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SupplyDigital Components

Austria . 2,297 parts In-Stock

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UHIMA Technologies

Türkiye . 967 parts In-Stock

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Corphita

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Corohmni

South Africa . 112 parts In-Stock

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Overview

Discover the NVMFS6B14NT1G by Onsemi, a high-quality Power Field Effect Transistor designed for enhanced performance in a variety of applications. With a single configuration and built-in diode, this N-channel transistor offers reliable power management solutions. From automotive to industrial applications, this product delivers exceptional value with its high power dissipation capabilities and low on-resistance. Trust Onsemi's expertise in semiconductor technology to provide you with a durable and efficient solution for your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are known for their high efficiency and fast switching speeds, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse polarity protection, making the product more user-friendly.

Surface Mount: YES

Being surface mountable, the FET can be easily integrated into compact electronic devices.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 140 A

The high pulsed drain current capability allows the FET to handle sudden high current demands effectively.

Avalanche Energy Rating (EAS): 29 mJ

The high avalanche energy rating ensures the FET can withstand sudden voltage spikes without damage.

Maximum Power Dissipation (Abs): 94 W

The high power dissipation capability makes the FET suitable for high-power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, the FET can operate reliably in harsh environments.

Maximum Drain-Source On Resistance: 0.015 ohm

The low on-resistance results in reduced power loss and improved efficiency in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS6B14NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

29 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

55 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.015 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

140 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS6B14NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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