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NVMFS5C612NLWFT3G

Onsemi

NVMFS5C612NLWFT3G by Onsemi

NVMFS5C612NLWFT3G by Onsemi is a single N-channel Power FET with 235A max drain current and 167W max power dissipation. Ideal for high-power applications, it operates at up to 175 °C and features metal-oxide semiconductor technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 45,000 parts In-Stock

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Flip Electronics

USA . 45,000 parts In-Stock

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Vyrian

USA . 8,392 parts In-Stock

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Digiode

USA . 2,449 parts In-Stock

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Microchip USA

USA . 271 parts In-Stock

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$7.408

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AZTECH Wire

Italy . 680 parts In-Stock

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SupplyDigital Components

Austria . 7,647 parts In-Stock

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Problanco Electronics

Mexico . 5,492 parts In-Stock

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TANS Electronics

Latvia . 2,582 parts In-Stock

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Kulean Microsystems

USA . 2,231 parts In-Stock

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Corphita

USA . 1,724 parts In-Stock

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UHIMA Technologies

Türkiye . 726 parts In-Stock

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Corohmni

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Overview

Elevate your power management solutions with the NVMFS5C612NLWFT3G by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power FET offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial, this single configuration transistor delivers maximum power dissipation of 167W and a drain current of 235A, ensuring optimal efficiency and functionality. Trust in Onsemi's cutting-edge technology and innovation to enhance your projects with ease. Experience the difference with the NVMFS5C612NLWFT3G today.

Feature Benefit Bullets

Polarity or Channel Type N-CHANNEL

N-channel FETs offer higher mobility and faster switching speeds compared to P-channel FETs, making them ideal for high-performance applications.

Configuration SINGLE

Single configuration simplifies circuit design and makes it easier to integrate this FET into existing systems.

Surface Mount YES

Surface mount allows for easier and more compact PCB design, saving space and reducing assembly time.

Maximum Drain Current (Abs) (ID) 235 A

High maximum drain current capability allows for handling heavy loads and high power applications.

Maximum Power Dissipation (Abs) 167 W

High power dissipation rating ensures the FET can handle large amounts of power without overheating.

Field Effect Transistor Technology METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low gate capacitance, high input impedance, and high switching speeds, making it suitable for a wide range of applications.

Maximum Operating Temperature 175 °C

High maximum operating temperature allows for reliable performance in demanding environments without thermal shutdown.

Terminal Finish Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections in various operating conditions.

Maximum Time At Peak Reflow Temperature (s) 30

Short reflow time minimizes thermal stress on the component, increasing its reliability during manufacturing processes.

Peak Reflow Temperature °C 260

High peak reflow temperature capability ensures proper soldering and mechanical stability of the FET during assembly.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C612NLWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

235 A

Maximum Drain Current (ID):

235 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5C612NLWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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