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NVMFS5C604NLT3G

Onsemi

NVMFS5C604NLT3G by Onsemi

NVMFS5C604NLT3G by Onsemi is a N-CHANNEL FET with 287A ID, 200W power dissipation, and 175 °C max operating temp. Ideal for high-power applications requiring efficient switching in surface-mount configurations.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 7,912 parts In-Stock

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Digiode

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Microchip USA

USA . 5,110 parts In-Stock

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AZTECH Wire

Italy . 40 parts In-Stock

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TANS Electronics

Latvia . 8,002 parts In-Stock

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Problanco Electronics

Mexico . 7,986 parts In-Stock

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SupplyDigital Components

Austria . 6,461 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 758 parts In-Stock

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Corohmni

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Kulean Microsystems

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Overview

Revolutionize your power management with the NVMFS5C604NLT3G by Onsemi. As a leader in Power Field Effect Transistors, Onsemi delivers top-quality products that guarantee reliability and efficiency. With its N-CHANNEL configuration and impressive maximum drain current of 287 A, this transistor is perfect for a wide range of applications. From industrial machinery to automotive systems, this FET offers unmatched performance and durability. Trust Onsemi to provide you with the tools you need to power up your projects and take your innovations to the next level.

Feature Benefit Bullets

Polarity/Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for high power applications due to their low ON-resistance and efficiency.

Configuration: SINGLE

Single configuration FETs are easier to design and control in circuits compared to multiple configurations.

Surface Mount: YES

Surface mount FETs are more compact and can be easily mounted on PCBs, saving valuable space.

Maximum Drain Current: 287 A

High maximum drain current allows the FET to handle large current loads, making it suitable for high power applications.

Maximum Power Dissipation: 200 W

High power dissipation capability ensures the FET can handle high power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good reliability and performance in power applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows the FET to operate in demanding environments without performance degradation.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finish provides good solderability and ensures reliable electrical connections.

Maximum Time At Peak Reflow Temperature: 30s

Short time at peak reflow temperature minimizes thermal stress on the FET during assembly and soldering.

Peak Reflow Temperature: 260 °C

High peak reflow temperature capability ensures proper soldering and reliability during assembly.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C604NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

287 A

Maximum Drain Current (ID):

287 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5C604NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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