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NVMFS5C460NWFT1G

Onsemi

NVMFS5C460NWFT1G by Onsemi

NVMFS5C460NWFT1G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 352A IDM, and 0.0053 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

$2.450

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,440 parts In-Stock

1+ parts

$2.450

100+ parts

$1.074

1k+ parts

$0.861

10k+ parts

$0.692

1,440

$2.450

$1.074

$0.861

$0.692

Distributors (In-Stock)

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Flip Electronics

USA . 10,500 parts In-Stock

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PC Components Company LLC

USA . 10,500 parts In-Stock

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Bristol Electronics

USA . 10,500 parts In-Stock

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Vyrian

USA . 5,588 parts In-Stock

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Digiode

USA . 1,806 parts In-Stock

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Chip Stock

USA . 1,025 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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Microchip USA

USA . 6,797 parts In-Stock

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$5.533

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$5.533

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AZTECH Wire

Italy . 513 parts In-Stock

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$20.980

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513

$20.980

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Ampacity Inc.

Singapore . 1,386 parts In-Stock

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$43.050

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iodParts Technologies Inc.

India . 10,500 parts In-Stock

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TANS Electronics

Latvia . 7,223 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 3,892 parts In-Stock

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Problanco Electronics

Mexico . 2,784 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 951 parts In-Stock

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SupplyDigital Components

Austria . 777 parts In-Stock

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Continental Prestige Electronics

USA . 521 parts In-Stock

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Corphita

USA . 92 parts In-Stock

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Kulean Microsystems

USA . 59 parts In-Stock

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Corohmni

South Africa . 57 parts In-Stock

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Overview

Unleash the power of innovation with the NVMFS5C460NWFT1G by Onsemi. This high-quality Power Field Effect Transistor (FET) offers unparalleled performance and reliability for a wide range of applications. With its N-CHANNEL configuration and built-in diode, this transistor ensures efficient power management and enhanced circuit protection. Experience seamless integration with its surface mount design and small outline package style. Trust Onsemi's expertise and cutting-edge technology to deliver exceptional value and benefits to your projects. Elevate your designs with the NVMFS5C460NWFT1G and stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better performance and lower resistance compared to P-channel transistors, making this product a good choice for high-power applications.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this transistor can handle higher voltages without failure, ensuring reliable operation in demanding conditions.

Maximum Pulsed Drain Current (IDM): 352 A

The high pulsed drain current rating of 352A allows this transistor to handle large surges of current, making it ideal for applications with high peak power requirements.

Maximum Power Dissipation (Abs): 50 W

With a maximum power dissipation of 50W, this transistor can efficiently handle heat dissipation, ensuring reliable performance under high load conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C460NWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1667 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

71 A

Maximum Drain Current (ID):

71 A

Maximum Drain-Source On Resistance:

.0053 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

22 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

352 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C460NWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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