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NVMFS5C442NLWFT1G

Onsemi

NVMFS5C442NLWFT1G by Onsemi

NVMFS5C442NLWFT1G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 130A Drain Current, and 0.0037 ohm On Resistance. Ideal for automotive applications due to AEC-Q101 standard compliance and high power dissipation of 83W in small outline package.

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Lifecycle Status

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1k+

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Flip Electronics

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Microchip USA

USA . 486 parts In-Stock

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AZTECH Wire

Italy . 1,022 parts In-Stock

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RC Electronics

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Problanco Electronics

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SupplyDigital Components

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Kulean Microsystems

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TANS Electronics

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Futuretech Components

Singapore . 2,980 parts In-Stock

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Overview

Discover the exceptional NVMFS5C442NLWFT1G by Onsemi, a top-tier Power Field Effect Transistor designed for high-performance applications. With a streamlined single configuration and built-in diode, this N-channel transistor offers unparalleled reliability and efficiency. Ideal for a wide range of projects, this device boasts a minimum DS Breakdown Voltage of 40V and a maximum Drain Current of 130A, making it a versatile choice for any project requiring enhanced power management. Elevate your designs with this cutting-edge solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the Power FET, making it reliable for various applications.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40 V, this Power FET can handle higher voltages, ensuring safe and efficient operation in different circuits.

Maximum Pulsed Drain Current (IDM): 900 A

The high maximum pulsed drain current capacity of 900 A allows for robust performance in heavy-duty applications where high current loads are required.

Maximum Power Dissipation (Abs): 83 W

The Power FET's high power dissipation rating of 83 W indicates its ability to efficiently handle power without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C enables the Power FET to operate effectively in extreme temperature conditions without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C442NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

265 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

130 A

Maximum Drain Current (ID):

130 A

Maximum Drain-Source On Resistance:

.0037 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

37 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C442NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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