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NVMFS5C442NLT3G

Onsemi

NVMFS5C442NLT3G by Onsemi

NVMFS5C442NLT3G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 130A ID, and 0.0037 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance. Enhances performance in power management systems with its high current handling capabilities.

Median Price

$0.714

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 5,000 parts In-Stock

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$0.818

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$0.610

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$0.551

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$0.818

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Verical

USA . 5,000 parts In-Stock

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$0.610

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$0.551

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$0.610

$0.551

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ComSIT Distribution GmbH

Germany . 131,250 parts In-Stock

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Chip Stock

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Flip Electronics

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Vyrian

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Digiode

USA . 2,053 parts In-Stock

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AZTECH Wire

Italy . 963 parts In-Stock

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$16.830

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Problanco Electronics

Mexico . 6,445 parts In-Stock

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TANS Electronics

Latvia . 5,878 parts In-Stock

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SupplyDigital Components

Austria . 5,637 parts In-Stock

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Kulean Microsystems

USA . 5,045 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 536 parts In-Stock

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Corohmni

South Africa . 114 parts In-Stock

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Overview

Elevate your power management systems with the NVMFS5C442NLT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product. This Power Field Effect Transistor (FET) is designed for high performance and efficiency, making it ideal for a wide range of applications. With its high power dissipation capacity and low drain-source resistance, this transistor offers unmatched value and benefits to customers looking to optimize their power systems. Trust Onsemi to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides excellent insulation and protection for the FET, ensuring reliable performance and durability.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and saves space by eliminating the need for an external diode.

Minimum DS Breakdown Voltage: 40 V

Higher breakdown voltage ensures the FET can handle higher loads and voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 900 A

High pulsed drain current allows the FET to handle sudden surges of current without damage, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

High operating temperature range ensures the FET can operate reliably even in demanding environmental conditions.

Maximum Drain-Source On Resistance: 0.0037 ohm

Low on-resistance (Rds(on)) results in minimal power loss and high efficiency, making the FET a cost-effective choice for power applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C442NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

265 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

130 A

Maximum Drain Current (ID):

130 A

Maximum Drain-Source On Resistance:

.0037 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

37 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C442NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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