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NVMFS5C430NLT3G

Onsemi

NVMFS5C430NLT3G by Onsemi

NVMFS5C430NLT3G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0022 ohm RDS(on). It is an N-CHANNEL MOSFET in a PLASTIC/EPOXY package ideal for automotive applications meeting AEC-Q101 standards.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 10,579 parts In-Stock

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Digiode

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Microchip USA

USA . 7,618 parts In-Stock

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$3.924

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AZTECH Wire

Italy . 549 parts In-Stock

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Component Stockers USA

USA . 328 parts In-Stock

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$99.990

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Perfect Parts

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TANS Electronics

Latvia . 4,336 parts In-Stock

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Kulean Microsystems

USA . 2,844 parts In-Stock

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Problanco Electronics

Mexico . 2,623 parts In-Stock

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SupplyDigital Components

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UHIMA Technologies

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Corphita

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Corohmni

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Overview

Enhance your power applications with the NVMFS5C430NLT3G by Onsemi. Designed with quality in mind, this N-channel Power FET offers superior performance and reliability. Its single configuration with a built-in diode makes it a versatile choice for a wide range of applications. From automotive to industrial, this transistor delivers exceptional value, providing customers with enhanced efficiency and durability. Trust Onsemi to deliver cutting-edge technology that meets your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the transistor, making it suitable for a range of operating conditions.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient conduction of current in the transistor, making it ideal for applications where low power consumption and high efficiency are required.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in the transistor allows for voltage clamping and protection against reverse polarity, providing an added level of reliability in circuit design.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed drain current rating of 900 A makes this transistor suitable for high-power applications where short bursts of current are required.

Avalanche Energy Rating (EAS): 493 mJ

The high avalanche energy rating of 493 mJ indicates that this transistor can withstand high-energy transient events, making it suitable for harsh operating environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this transistor provides high performance and reliability, ensuring stable operation in various circuit designs.

Maximum Drain-Source On Resistance: 0.0022 ohm

The low drain-source on resistance of 0.0022 ohm minimizes power loss and heat generation in the transistor, improving overall efficiency in power management applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C430NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

493 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain-Source On Resistance:

.0022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C430NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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