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NVMFS5C426NT3G

Onsemi

NVMFS5C426NT3G by Onsemi

NVMFS5C426NT3G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0013 ohm RDS(on). Ideal for power applications in automotive industry due to AEC-Q101 standard compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics

USA . 46,500 parts In-Stock

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46,500

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Vyrian

USA . 3,872 parts In-Stock

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Digiode

USA . 1,184 parts In-Stock

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Nova Conductors

Japan . 23 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,986 parts In-Stock

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$0.470

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4,986

$0.470

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Microchip USA

USA . 349 parts In-Stock

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$4.480

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349

$4.480

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AZTECH Wire

Italy . 532 parts In-Stock

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$6.486

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532

$6.486

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Semicontronic

India . 345 parts In-Stock

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$19.050

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$18.574

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$18.478

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345

$19.050

$18.574

$18.478

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Ampacity Inc.

Singapore . 255 parts In-Stock

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$22.050

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Perfect Parts

USA . 23,491 parts In-Stock

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TANS Electronics

Latvia . 5,452 parts In-Stock

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Continental Prestige Electronics

USA . 2,253 parts In-Stock

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SupplyDigital Components

Austria . 2,024 parts In-Stock

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Kulean Microsystems

USA . 1,511 parts In-Stock

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Argo Parts USA

USA . 1,128 parts In-Stock

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UHIMA Technologies

Türkiye . 980 parts In-Stock

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Corphita

USA . 871 parts In-Stock

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Corohmni

South Africa . 349 parts In-Stock

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349

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Problanco Electronics

Mexico . 329 parts In-Stock

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329

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unlock the power of innovation with the NVMFS5C426NT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are essential for a wide range of applications. With its N-CHANNEL configuration and built-in diode, this transistor offers unrivaled performance and reliability. Experience enhanced efficiency and superior functionality with the NVMFS5C426NT3G, providing customers with unmatched value and benefits that elevate their projects to new heights. Choose Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the FET a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically offer better performance and efficiency compared to P-Channel FETs, making them suitable for many power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can be useful for applications requiring reverse voltage protection.

Surface Mount: YES

Surface mount packaging allows for easier assembly onto circuit boards, saving space and potentially reducing manufacturing costs.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can handle demanding conditions without sacrificing performance.

Maximum Drain-Source On Resistance: 0.0013 ohm

Low on-resistance minimizes power loss and heat generation, improving the efficiency of the FET in power management applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C426NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

739 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

235 A

Maximum Drain Current (ID):

235 A

Maximum Drain-Source On Resistance:

.0013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

59 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C426NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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