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NVMFS5C423NLWFT1G

Onsemi

NVMFS5C423NLWFT1G by Onsemi

NVMFS5C423NLWFT1G by Onsemi is a Power FET with N-CHANNEL polarity, 40V DS breakdown voltage, and 900A pulsed drain current. Ideal for applications requiring high power dissipation in small outline packages, such as automotive electronics meeting AEC-Q101 standards.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,200 parts In-Stock

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Digiode

USA . 2,003 parts In-Stock

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Microchip USA

USA . 165 parts In-Stock

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$4.106

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AZTECH Wire

Italy . 335 parts In-Stock

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$16.330

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Component Stockers USA

USA . 269 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 6,779 parts In-Stock

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SupplyDigital Components

Austria . 2,482 parts In-Stock

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Corphita

USA . 2,167 parts In-Stock

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TANS Electronics

Latvia . 2,084 parts In-Stock

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Problanco Electronics

Mexico . 1,889 parts In-Stock

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UHIMA Technologies

Türkiye . 285 parts In-Stock

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Corohmni

South Africa . 155 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the NVMFS5C423NLWFT1G by Onsemi. Crafted by a renowned manufacturer, this N-CHANNEL Power FET offers unparalleled performance and reliability. Ideal for a wide range of applications, this single with built-in diode configuration delivers maximum efficiency and versatility. With a minimum DS breakdown voltage of 40V and a maximum drain current of 150A, this transistor is designed to exceed expectations. Elevate your projects with the industry-leading quality and value of the Onsemi NVMFS5C423NLWFT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability in a variety of operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower conduction losses and higher efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for improved circuit protection and efficiency.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on PCBs.

Minimum DS Breakdown Voltage: 40 V

High breakdown voltage ensures reliable operation in high voltage applications.

Maximum Pulsed Drain Current (IDM): 900 A

High pulsed drain current capability allows for handling of sudden power surges.

Maximum Power Dissipation (Abs): 83 W

High power dissipation capacity enables the FET to handle high current and voltage.

Maximum Operating Temperature: 175 °C

High operating temperature range allows for use in demanding environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C423NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

280 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

150 A

Maximum Drain Current (ID):

150 A

Maximum Drain-Source On Resistance:

.003 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C423NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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