Loading...

NVMFS5C423NLT1G

Onsemi

NVMFS5C423NLT1G by Onsemi

NVMFS5C423NLT1G by Onsemi is a Power FET with N-CHANNEL polarity, 40V DS Breakdown Voltage, and 900A Max Pulsed Drain Current. Ideal for applications requiring high power dissipation in small outline packages, such as automotive systems or industrial equipment.

Median Price

$0.450

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 310 parts In-Stock

1+ parts

$0.450

100+ parts

$0.440

1k+ parts

$0.430

10k+ parts

-

310

$0.450

$0.440

$0.430

-

Avnet

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 371 parts In-Stock

1+ parts

$0.428

100+ parts

-

1k+ parts

-

10k+ parts

-

371

$0.428

-

-

-

Vyrian

USA . 6,439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,439

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 748 parts In-Stock

1+ parts

$0.405

100+ parts

-

1k+ parts

-

10k+ parts

-

748

$0.405

-

-

-

Corohmni

South Africa . 93 parts In-Stock

1+ parts

$0.450

100+ parts

-

1k+ parts

-

10k+ parts

-

93

$0.450

-

-

-

Microchip USA

USA . 458 parts In-Stock

1+ parts

$3.771

100+ parts

-

1k+ parts

-

10k+ parts

-

458

$3.771

-

-

-

AZTECH Wire

Italy . 954 parts In-Stock

1+ parts

$21.790

100+ parts

-

1k+ parts

-

10k+ parts

-

954

$21.790

-

-

-

SupplyDigital Components

Austria . 8,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,028

-

-

-

-

TANS Electronics

Latvia . 6,697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,697

-

-

-

-

Problanco Electronics

Mexico . 5,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,660

-

-

-

-

Kulean Microsystems

USA . 1,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,760

-

-

-

-

Perfect Parts

USA . 1,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,680

-

-

-

-

UHIMA Technologies

Türkiye . 630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

630

-

-

-

-

Authorized Procurement Solutions

USA . 240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

240

-

-

-

-

Overview

Power up your applications with the NVMFS5C423NLT1G by Onsemi, a top-of-the-line Power Field Effect Transistor (FET) that guarantees high performance and reliability. With a single configuration and built-in diode, this N-channel transistor offers seamless operation and efficient power management. Whether you're in the automotive industry or working on industrial projects, this product is designed to meet your needs with its superior quality and advanced technology. Trust Onsemi to deliver the best in power transistors for all your application requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs offer good performance characteristics and are commonly used in different electronic devices.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can provide additional protection against voltage spikes.

Surface Mount: YES

Being surface mount compatible allows for easier and more efficient installation on circuit boards.

Minimum DS Breakdown Voltage: 40 V

The minimum breakdown voltage of 40V ensures reliable operation within specified voltage limits.

Maximum Pulsed Drain Current (IDM): 900 A

With a high maximum pulsed drain current, this FET can handle heavy loads during short duration pulses.

Maximum Power Dissipation (Abs): 83 W

The high maximum power dissipation rating indicates the FET's ability to handle power efficiently and prevent overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high performance, low power consumption, and long-term reliability.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for reliable operation in demanding environments.

Maximum Drain-Source On Resistance: 0.003 ohm

Low drain-source on resistance ensures minimal power loss and high efficiency in the FET.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C423NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

280 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

150 A

Maximum Drain Current (ID):

150 A

Maximum Drain-Source On Resistance:

.003 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C423NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20