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NVMFS5A160PLZWFT1G

Onsemi

NVMFS5A160PLZWFT1G by Onsemi

NVMFS5A160PLZWFT1G by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, 400A IDM, and 0.0105 ohm RDS(ON). Ideal for power applications in automotive industry due to AEC-Q101 standard compliance and high operating temperature range of -55 to 175 °C.

Median Price

$7.273

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$1.476

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Mobius Materials

USA . 100 parts In-Stock

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$13.070

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$10.470

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Vyrian

USA . 6,695 parts In-Stock

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Chip Stock

USA . 2,842 parts In-Stock

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Digiode

USA . 2,308 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,239 parts In-Stock

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NexGen Digital

USA . 1 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 747 parts In-Stock

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$1.220

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747

$1.220

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$1.344

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$1.223

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$1.102

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$1.344

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Corohmni

South Africa . 413 parts In-Stock

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$1.418

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Argo Parts USA

USA . 2,257 parts In-Stock

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$1.476

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Continental Prestige Electronics

USA . 1,119 parts In-Stock

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$2.060

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$1.520

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$1.090

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Ampacity Inc.

Singapore . 304 parts In-Stock

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$5.050

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AZTECH Wire

Italy . 347 parts In-Stock

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$6.752

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S.R.D Solutions

India . 64,000 parts In-Stock

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TANS Electronics

Latvia . 7,924 parts In-Stock

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Kulean Microsystems

USA . 7,362 parts In-Stock

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Lixinc

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Corphita

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Netroflash

USA . 2,000 parts In-Stock

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$1.402

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$1.373

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SupplyDigital Components

Austria . 1,261 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Problanco Electronics

Mexico . 395 parts In-Stock

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UHIMA Technologies

Türkiye . 3 parts In-Stock

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Overview

Discover the unparalleled performance of the NVMFS5A160PLZWFT1G by Onsemi, a top-tier Power Field Effect Transistor designed for efficiency and reliability. With its P-CHANNEL configuration and built-in diode, this transistor is ideal for a wide range of applications. From automotive to industrial electronics, this transistor offers exceptional value with its high-quality construction and advanced technology. Trust in Onsemi's expertise and choose the NVMFS5A160PLZWFT1G for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good thermal and electrical insulation, making the FET more reliable and durable.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are often used in power management applications and can provide efficient power control.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode helps to protect the FET against reverse voltage and can simplify circuit design.

Surface Mount: YES

Surface mount technology allows for easier and more automated assembly of electronic circuits, saving time and cost.

Minimum DS Breakdown Voltage: 60 V

This high breakdown voltage allows the FET to handle higher power levels without failure, ensuring reliable operation.

Package Shape: RECTANGULAR

The rectangular package shape provides a more compact design, saving space in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to use in electronic circuits as they are normally off and require a positive voltage to turn on.

Maximum Pulsed Drain Current (IDM): 400 A

With a high pulsed drain current rating, this FET can handle large initial current spikes without damage.

Avalanche Energy Rating (EAS): 335 mJ

The high avalanche energy rating indicates that the FET can withstand the energy generated during avalanche breakdown, improving reliability.

No. of Terminals: 5

Having 5 terminals allows for more connections and functionality in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for denser packing of components.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good switching characteristics, low gate leakage, and high input impedance.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate in demanding environments without overheating.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability, high efficiency, and ease of manufacturing.

Minimum Operating Temperature: -55 °C

The wide temperature range allows this FET to be used in both high and low-temperature environments.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good electrical conductivity and corrosion resistance, ensuring optimal performance over time.

Maximum Drain-Source On Resistance: 0.0105 ohm

The low on-resistance of the FET reduces power losses and improves efficiency in power management applications.

Terminal Position: DUAL

Having dual terminal positions allows for easier connection in different circuit layouts.

Case Connection: DRAIN

The drain case connection provides a common connection point for the drain terminal, simplifying circuit design.

Maximum Time At Peak Reflow Temperature (s): 10

With a short time at peak reflow temperature, the FET can be efficiently soldered onto the circuit board without damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering of the FET onto the circuit board.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures that the FET meets automotive-grade reliability requirements for harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5A160PLZWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

335 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain-Source On Resistance:

.0105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5A160PLZWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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