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NVMFS5844NLT3G

Onsemi

NVMFS5844NLT3G by Onsemi

NVMFS5844NLT3G by Onsemi is a N-channel Power FET with 60V DS breakdown voltage, 61A max drain current, and 0.016 ohm RDS(on). Ideal for power management applications due to its 107W max power dissipation, small outline package style, and -55 to 175°C operating temperature range.

Median Price

$0.452

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

$0.452

100+ parts

$0.425

1k+ parts

$0.384

10k+ parts

-

5,000

$0.452

$0.425

$0.384

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Arrow

USA . 95,000 parts In-Stock

1+ parts

$0.602

100+ parts

$0.446

1k+ parts

$0.401

10k+ parts

-

95,000

$0.602

$0.446

$0.401

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Verical

USA . 95,000 parts In-Stock

1+ parts

-

100+ parts

$0.446

1k+ parts

$0.401

10k+ parts

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95,000

-

$0.446

$0.401

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Distributors (In-Stock)

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Digiode

USA . 1,705 parts In-Stock

1+ parts

$0.429

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1,705

$0.429

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Nova Conductors

Japan . 97 parts In-Stock

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$1.000

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97

$1.000

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Chip Stock

USA . 72,000 parts In-Stock

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72,000

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Vyrian

USA . 4,468 parts In-Stock

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4,468

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,508 parts In-Stock

1+ parts

$0.384

100+ parts

-

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4,508

$0.384

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Corphita

USA . 929 parts In-Stock

1+ parts

$0.407

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-

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929

$0.407

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Corohmni

South Africa . 317 parts In-Stock

1+ parts

$0.452

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317

$0.452

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Continental Prestige Electronics

USA . 6,325 parts In-Stock

1+ parts

$1.000

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$0.980

6,325

$1.000

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$0.980

Argo Parts USA

USA . 3,292 parts In-Stock

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$1.000

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3,292

$1.000

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Netroflash

USA . 500 parts In-Stock

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$1.000

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$0.980

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500

$1.000

$0.980

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AZTECH Wire

Italy . 763 parts In-Stock

1+ parts

$11.800

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763

$11.800

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Lixinc

USA . 14,463 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 5,656 parts In-Stock

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TANS Electronics

Latvia . 5,278 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,284 parts In-Stock

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Kulean Microsystems

USA . 1,023 parts In-Stock

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SupplyDigital Components

Austria . 968 parts In-Stock

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968

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UHIMA Technologies

Türkiye . 559 parts In-Stock

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Microchip USA

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Overview

Discover the NVMFS5844NLT3G by Onsemi, a top-tier manufacturer known for producing high-quality Power Field Effect Transistors. This N-channel FET with a built-in diode offers exceptional performance and reliability in various applications. Whether you're looking to enhance your power management system or boost efficiency, this transistor is the perfect solution. With a maximum drain current of 61A and a low on-resistance, you can trust in the value and benefits that this product provides. Upgrade your electronics with the NVMFS5844NLT3G and experience the advantages of cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product reliable for long-term use.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can protect against reverse voltage polarity, enhancing overall efficiency.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages and is suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 247 A

The high pulsed drain current allows for momentary high-power operation, ideal for applications requiring short bursts of energy.

Maximum Power Dissipation (Abs): 107 W

With a high power dissipation rating, this FET can handle significant power loads without overheating, ensuring reliability in demanding conditions.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows for operation in a variety of environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5844NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

61 A

Maximum Drain Current (ID):

61 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

247 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5844NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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