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NVMFS5844NLT1G

Onsemi

NVMFS5844NLT1G by Onsemi

NVMFS5844NLT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 61A Drain Current, and 0.016 ohm RDS(ON). Ideal for power applications in automotive industry due to AEC-Q101 standard compliance.

Median Price

$0.526

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 179,339 parts In-Stock

1+ parts

-

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$0.526

1k+ parts

$0.437

10k+ parts

$0.390

179,339

-

$0.526

$0.437

$0.390

Distributors (In-Stock)

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Digiode

USA . 1,696 parts In-Stock

1+ parts

$0.429

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-

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1,696

$0.429

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Chip Stock

USA . 27,000 parts In-Stock

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27,000

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Vyrian

USA . 4,526 parts In-Stock

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4,526

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Ampacity Inc.

Singapore . 179,763 parts In-Stock

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$0.384

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$0.384

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Corphita

USA . 1,337 parts In-Stock

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$0.407

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$0.407

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Corohmni

South Africa . 122 parts In-Stock

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$0.452

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122

$0.452

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AZTECH Wire

Italy . 182 parts In-Stock

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$22.150

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Perfect Parts

USA . 47,376 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,805 parts In-Stock

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Metaverse IC Inc.

Canada . 21,000 parts In-Stock

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Lixinc

USA . 12,426 parts In-Stock

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TANS Electronics

Latvia . 8,199 parts In-Stock

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SupplyDigital Components

Austria . 6,956 parts In-Stock

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Kepictronics

USA . 5,800 parts In-Stock

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Problanco Electronics

Mexico . 4,134 parts In-Stock

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Kulean Microsystems

USA . 2,969 parts In-Stock

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Continental Prestige Electronics

USA . 1,460 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Argo Parts USA

USA . 110 parts In-Stock

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UHIMA Technologies

Türkiye . 3 parts In-Stock

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Overview

Unlock unparalleled power and efficiency with the NVMFS5844NLT1G by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor boasts a single configuration with a built-in diode for enhanced performance. Ideal for a wide range of applications, this transistor offers a maximum drain current of 61A and a minimum DS breakdown voltage of 60V, ensuring unmatched reliability in every use. Experience superior quality and value with Onsemi's cutting-edge technology, setting new standards in power FET innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and allows for compact and lightweight design, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and faster switching speed compared to P-channel FETs, making them more efficient for many applications.

Maximum Drain-Source On Resistance: 0.016 ohm

Low ON-resistance means lower power dissipation and improved efficiency, making this FET a great choice for high-performance applications.

Maximum Power Dissipation (Abs): 107 W

With a high power dissipation rating, this FET can handle high current and power levels without overheating, ensuring reliability in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off and require a positive voltage on the gate to turn on, allowing for easier control and protection against accidental activation.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5844NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

61 A

Maximum Drain Current (ID):

61 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

247 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5844NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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