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NVMFS5833NWFT1G

Onsemi

NVMFS5833NWFT1G by Onsemi

NVMFS5833NWFT1G by Onsemi is a single N-channel Power FET with 86A max drain current and 112W max power dissipation. Utilizes metal-oxide semiconductor technology, operates up to 175 °C. Ideal for high-power applications requiring efficient switching and thermal performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,855 parts In-Stock

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Digiode

USA . 1,760 parts In-Stock

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AZTECH Wire

Italy . 127 parts In-Stock

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$17.140

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TANS Electronics

Latvia . 4,215 parts In-Stock

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Kulean Microsystems

USA . 2,561 parts In-Stock

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SupplyDigital Components

Austria . 1,988 parts In-Stock

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Perfect Parts

USA . 1,176 parts In-Stock

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Problanco Electronics

Mexico . 1,049 parts In-Stock

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Corohmni

South Africa . 372 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 211 parts In-Stock

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Overview

Elevate your power management solutions with the NVMFS5833NWFT1G by Onsemi. This top-of-the-line N-CHANNEL Power Field Effect Transistor offers unparalleled performance and reliability for a wide range of applications. With a maximum drain current of 86A and a maximum power dissipation of 112W, this FET delivers superior efficiency and functionality. Whether you're in the automotive, industrial, or consumer electronics industry, this product is the perfect choice for your power control needs. Trust in Onsemi's reputation for excellence and choose the NVMFS5833NWFT1G for unmatched quality and value.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower on-state resistance and better efficiency compared to P-CHANNEL FETs, making them a good choice for high power applications.

Configuration: SINGLE

Single configuration FETs are simpler to use and control in circuit design, making them a reliable choice for various applications.

Surface Mount: YES

Surface mount FETs save space on the PCB and allow for automated assembly processes, making them ideal for compact electronic devices.

Maximum Drain Current (ID): 86 A

High maximum drain current capability allows this FET to handle heavy loads and high power requirements effectively.

Maximum Power Dissipation: 112 W

With a high maximum power dissipation value, this FET can withstand and dissipate heat effectively, ensuring reliable operation under high power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good switching characteristics and low gate capacitance, making this FET suitable for high-frequency applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising performance, ensuring reliability in various environments.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity, facilitating easy and reliable connections in the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time allows for quick and efficient assembly processes, reducing production time and costs.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the FET can withstand the soldering process without damage, ensuring reliable connections on the PCB.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5833NWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

86 A

Maximum Drain Current (ID):

86 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5833NWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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