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NVMFS5826NLWFT1G

Onsemi

NVMFS5826NLWFT1G by Onsemi

NVMFS5826NLWFT1G by Onsemi is a N-CHANNEL FET with 26A max drain current and 39W power dissipation. Ideal for power management applications, it operates at up to 175 °C, making it suitable for high-temperature environments. With surface mount configuration and matte tin finish, it offers efficient performance in various electronic devices.

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

USA . 90,500 parts In-Stock

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AZTECH Wire

Italy . 1,100 parts In-Stock

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Component Stockers USA

USA . 441 parts In-Stock

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RC Electronics

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SupplyDigital Components

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TANS Electronics

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Overview

Enhance your power management solutions with the NVMFS5826NLWFT1G by Onsemi. Crafted with precision and reliability, Onsemi's field-effect transistors are designed to deliver superior performance in a variety of applications. From industrial automation to automotive electronics, this N-channel FET offers unmatched efficiency and power handling capabilities. Trust Onsemi for quality components that exceed expectations and elevate your projects to new heights. Experience the difference with the NVMFS5826NLWFT1G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally offer lower on-resistance and higher efficiency, making them suitable for high power applications.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and can be easily integrated into systems.

Surface Mount: YES

Surface Mount technology allows for compact and space-saving designs, ideal for applications where space is limited.

Maximum Drain Current (Abs) (ID): 26 A

With a high maximum drain current, this FET can handle high power loads, making it suitable for applications requiring high current capabilities.

Maximum Power Dissipation (Abs): 39 W

High power dissipation capability ensures the FET can handle thermal stress and operate reliably under high power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers good performance and reliability, making this FET a dependable choice for various applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures and operate effectively in demanding environments.

Terminal Finish: MATTE TIN

Matte Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections in the application.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of thermal damage during manufacturing processes, ensuring product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for robust soldering processes, ensuring strong mechanical and electrical connections.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5826NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

26 A

Maximum Drain Current (ID):

26 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5826NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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