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NVMFS4C01NT3G

Onsemi

NVMFS4C01NT3G by Onsemi

NVMFS4C01NT3G by Onsemi is a Power FET with 30V DS Breakdown Voltage, 900A IDM, and 0.00095 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance. Enhances performance in power management systems with its high current handling capabilities.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

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Digiode

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AZTECH Wire

Italy . 864 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,309 parts In-Stock

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SupplyDigital Components

Austria . 6,004 parts In-Stock

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Problanco Electronics

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Microchip USA

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Kulean Microsystems

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 1,263 parts In-Stock

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Corphita

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Corohmni

South Africa . 401 parts In-Stock

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UHIMA Technologies

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Overview

Unleash the power of innovation with the NVMFS4C01NT3G by Onsemi. As a leader in Power Field Effect Transistors (FET), Onsemi delivers top-quality products with unmatched reliability. Ideal for a wide range of applications, this N-channel transistor offers enhanced performance and efficiency. With a built-in diode and small outline package style, customers can expect exceptional value and benefits. Experience seamless operation and maximum power dissipation with the NVMFS4C01NT3G, the ultimate choice for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good thermal performance and durability to the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them a popular choice in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier design implementation and can help protect the FET from reverse currents or voltage spikes.

Surface Mount: YES

Surface mount technology saves space on the PCB and allows for automated assembly, making it suitable for mass production.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage allows for reliable operation in high voltage applications, providing protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed drain current rating allows for handling large current spikes and surges, making the FET suitable for high power applications.

Avalanche Energy Rating (EAS): 862 mJ

The high avalanche energy rating indicates the FET's ability to withstand energy spikes, enhancing the reliability of the product in harsh operating conditions.

Maximum Power Dissipation (Abs): 3.84 W

The high power dissipation rating ensures the FET can handle high power levels without overheating, contributing to its reliability.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the FET to operate in high-temperature environments without performance degradation.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB and offers high power density, ideal for compact power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers fast switching speeds, low on-resistance, and high efficiency, making it suitable for power management applications.

Maximum Drain-Source On Resistance: 0.00095 ohm

The low on-resistance minimizes power losses and heat dissipation, improving the efficiency of the FET in power applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS4C01NT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

862 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

319 A

Maximum Drain Current (ID):

319 A

Maximum Drain-Source On Resistance:

.00095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS4C01NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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