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NVMFS4841NT1G

Onsemi

NVMFS4841NT1G by Onsemi

NVMFS4841NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 336A IDM, and 0.0114 ohm RDS(ON). Ideal for power management applications in automotive industry due to AEC-Q101 standard compliance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,830 parts In-Stock

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Digiode

USA . 1,425 parts In-Stock

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Sunrise Surplus Inc.

USA . 100 parts In-Stock

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AZTECH Wire

Italy . 86 parts In-Stock

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$14.620

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86

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Kulean Microsystems

USA . 4,469 parts In-Stock

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TANS Electronics

Latvia . 3,146 parts In-Stock

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Corphita

USA . 2,181 parts In-Stock

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SupplyDigital Components

Austria . 1,942 parts In-Stock

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Problanco Electronics

Mexico . 741 parts In-Stock

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741

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Corohmni

South Africa . 183 parts In-Stock

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UHIMA Technologies

Türkiye . 97 parts In-Stock

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Overview

Discover the power of the NVMFS4841NT1G by Onsemi, a top-tier manufacturer known for delivering premium quality Power Field Effect Transistors. Ideal for a wide range of applications, this N-channel transistor offers exceptional performance with its single configuration and built-in diode. With a maximum operating temperature of 175 °C and an impressive 336 A pulsed drain current, this transistor ensures reliable and efficient operation. Experience the value and benefits of this product firsthand, as it provides customers with superior functionality and durability, making it a smart choice for any project that requires high-performance components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient freewheeling of inductive loads, providing protection against voltage spikes.

Surface Mount: YES

Enables easy and efficient mounting on a PCB, saving space and making assembly easier.

Maximum Drain Current (ID): 16 A

With a high maximum drain current rating, this FET can handle high power loads with ease.

Maximum Drain-Source On Resistance: 0.0114 ohm

Low on-resistance results in reduced power loss and higher efficiency, making this FET suitable for high power applications.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without compromising performance or reliability, suitable for demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS4841NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

89 A

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.0114 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

336 A

Qualification:

Not Qualified

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVMFS4841NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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