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NVMFD5C478NLWFT1G

Onsemi

NVMFD5C478NLWFT1G by Onsemi

NVMFD5C478NLWFT1G by Onsemi is an N-CHANNEL Power FET with 40V DS Breakdown Voltage and 98A Pulsed Drain Current. Ideal for automotive applications due to AEC-Q101 standard compliance, it features a compact rectangular package and low on-resistance of 0.025 ohm.

Median Price

$2.420

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 978 parts In-Stock

1+ parts

$2.420

100+ parts

$1.060

1k+ parts

$0.807

10k+ parts

$0.758

978

$2.420

$1.060

$0.807

$0.758

Distributors (In-Stock)

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Digiode

USA . 2,477 parts In-Stock

1+ parts

$1.492

100+ parts

-

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2,477

$1.492

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Flip Electronics

USA . 186,000 parts In-Stock

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186,000

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PC Components Company LLC

USA . 8,800 parts In-Stock

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8,800

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Bristol Electronics

USA . 8,800 parts In-Stock

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8,800

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Vyrian

USA . 3,352 parts In-Stock

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3,352

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Advanced Electronics

New Zealand . 82 parts In-Stock

1+ parts

$0.946

100+ parts

$0.861

1k+ parts

$0.776

10k+ parts

-

82

$0.946

$0.861

$0.776

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Ampacity Inc.

Singapore . 1,156 parts In-Stock

1+ parts

$1.330

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1,156

$1.330

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Corphita

USA . 790 parts In-Stock

1+ parts

$1.413

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790

$1.413

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Aztec Data Supply Inc.

USA . 252 parts In-Stock

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$1.497

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252

$1.497

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Corohmni

South Africa . 249 parts In-Stock

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$1.570

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249

$1.570

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Microchip USA

USA . 9,563 parts In-Stock

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$5.295

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9,563

$5.295

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iodParts Technologies Inc.

India . 8,800 parts In-Stock

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8,800

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Authorized Procurement Solutions

USA . 8,500 parts In-Stock

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8,500

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TANS Electronics

Latvia . 7,380 parts In-Stock

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Continental Prestige Electronics

USA . 4,326 parts In-Stock

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4,326

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Aranea Global

USA . 2,000 parts In-Stock

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Kulean Microsystems

USA . 1,936 parts In-Stock

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Argo Parts USA

USA . 1,725 parts In-Stock

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1,725

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SupplyDigital Components

Austria . 1,102 parts In-Stock

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UHIMA Technologies

Türkiye . 796 parts In-Stock

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Problanco Electronics

Mexico . 477 parts In-Stock

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477

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Overview

Experience the power of innovation with the NVMFD5C478NLWFT1G by Onsemi. As a leader in the manufacturing industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are designed to enhance performance and efficiency in various applications. With a focus on precision engineering and reliability, this N-CHANNEL transistor offers customers exceptional value and benefits. Whether you're looking to optimize your electronics or improve energy efficiency, the NVMFD5C478NLWFT1G is the perfect solution for your needs. Elevate your projects with Onsemi's cutting-edge technology and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance and higher current carrying capacity compared to P-Channel FETs.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Allows for more efficient power handling and protection against reverse current flow.

Maximum Drain-Source On Resistance: 0.025 ohm

Low ON resistance results in less power dissipation and improved efficiency.

Maximum Operating Temperature: 175 °C

Can withstand higher operating temperatures, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 23 W

Can handle high power levels without overheating, ensuring reliable operation.

Technical Specifications

Power Field Effect Transistors (FET) NVMFD5C478NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

48 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

29 A

Maximum Drain Current (ID):

10.5 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

9 pF

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

98 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFD5C478NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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