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NVMFD5877NLT1G

Onsemi

NVMFD5877NLT1G by Onsemi

NVMFD5877NLT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 74A IDM, and 0.06 ohm RDS. It's used for SWITCHING applications due to its 2 ELEMENTS WITH BUILT-IN DIODE configuration. Operating at 175°C max temp, it's ideal for high-power requirements in various electronic devices.

Median Price

$0.393

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 42 parts In-Stock

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$0.393

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Chip Stock

USA . 9,700 parts In-Stock

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Vyrian

USA . 4,433 parts In-Stock

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Digiode

USA . 1,266 parts In-Stock

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LWI Electronics Inc

India . 233 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 138 parts In-Stock

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$0.385

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138

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Netroflash

USA . 2,000 parts In-Stock

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$0.393

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$0.393

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Aztec Data Supply Inc.

USA . 697 parts In-Stock

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$0.500

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697

$0.500

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AZTECH Wire

Italy . 581 parts In-Stock

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$17.202

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Ampacity Inc.

Singapore . 391 parts In-Stock

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$45.050

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Infinite Electronics LLP (Excess)

. 177,011 parts In-Stock

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RC Electronics

USA . 68,103 parts In-Stock

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Perfect Parts

USA . 51,800 parts In-Stock

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Lixinc

USA . 17,053 parts In-Stock

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TANS Electronics

Latvia . 8,278 parts In-Stock

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Kulean Microsystems

USA . 7,367 parts In-Stock

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Problanco Electronics

Mexico . 6,998 parts In-Stock

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Continental Prestige Electronics

USA . 2,958 parts In-Stock

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Argo Parts USA

USA . 2,468 parts In-Stock

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Corphita

USA . 2,444 parts In-Stock

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SupplyDigital Components

Austria . 2,370 parts In-Stock

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Kepictronics

USA . 228 parts In-Stock

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UHIMA Technologies

Türkiye . 22 parts In-Stock

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iodParts Technologies Inc.

India . 7 parts In-Stock

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Overview

Enhance your power switching applications with the NVMFD5877NLT1G by Onsemi. Crafted with precision and quality, this N-channel Power FET boasts a separate, 2-element design with a built-in diode for seamless operation. Whether you're looking to optimize performance in automotive systems, industrial controls, or DC-DC converters, this transistor is your go-to solution. With a maximum operating temperature of 175°C and a low on-resistance of 0.06 ohm, this FET ensures high efficiency and reliability. Trust Onsemi’s expertise and elevate your designs with the NVMFD5877NLT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Offers better efficiency and performance in various applications compared to P-Channel FETs.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Allows for versatile use in different circuit designs and provides added functionality with the built-in diode.

Transistor Application: SWITCHING

Suitable for applications requiring fast switching speeds and high efficiency.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving space and improving heat dissipation.

Minimum DS Breakdown Voltage: 60 V

Provides a high breakdown voltage for better protection against voltage spikes and surges.

Maximum Pulsed Drain Current (IDM): 74 A

Allows for handling high current loads during short pulses, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 10.5 mJ

Can withstand high energy spikes without breaking down, ensuring reliability in harsh operating conditions.

Maximum Drain Current (Abs) (ID): 17 A

Capable of handling high continuous current without overheating, making it suitable for power-hungry applications.

Maximum Power Dissipation (Abs): 23 W

Efficiently dissipates heat generated during operation, preventing overheating and ensuring the reliability of the product.

Technical Specifications

Power Field Effect Transistors (FET) NVMFD5877NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

10.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

74 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVMFD5877NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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