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NVMFD5853NT1G

Onsemi

NVMFD5853NT1G by Onsemi

NVMFD5853NT1G by Onsemi is an N-CHANNEL Power FET with 53A max drain current and 58W power dissipation. Ideal for applications requiring high power handling in enhancement mode operation, such as power supplies and motor control systems.

Median Price

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Lifecycle Status

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3

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1k+

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Chip Stock

USA . 66,000 parts In-Stock

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Vyrian

USA . 6,196 parts In-Stock

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Digiode

USA . 1,307 parts In-Stock

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AZTECH Wire

Italy . 523 parts In-Stock

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$17.130

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QUARKTWIN TECHNOLOGY LTD

USA . 26,815 parts In-Stock

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TANS Electronics

Latvia . 7,720 parts In-Stock

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SupplyDigital Components

Austria . 7,092 parts In-Stock

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Problanco Electronics

Mexico . 6,775 parts In-Stock

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Perfect Parts

USA . 4,032 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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Kulean Microsystems

USA . 1,985 parts In-Stock

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Corphita

USA . 1,794 parts In-Stock

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Corohmni

South Africa . 499 parts In-Stock

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UHIMA Technologies

Türkiye . 498 parts In-Stock

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Overview

Unleash the power of innovation with the NVMFD5853NT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that cater to a wide range of applications. The N-CHANNEL configuration ensures enhanced performance, while the METAL-OXIDE SEMICONDUCTOR technology guarantees reliability and efficiency. With a maximum Drain Current of 53A and Power Dissipation of 58W, this transistor is a game-changer in the field. Experience the value and benefits of this product today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in power applications due to their high efficiency and fast switching speeds.

Surface Mount: YES

Surface mount FETs are easier to handle and mount on PCBs, saving space and improving overall efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the flow of current, making them ideal for power regulation and switching applications.

Maximum Drain Current (Abs) (ID): 53 A

With a high maximum drain current, this FET can handle high power loads without overheating or failing.

Maximum Power Dissipation (Abs): 58 W

With a high maximum power dissipation, this FET can effectively dissipate heat generated during operation, ensuring reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer good overall performance with low gate capacitance and high switching speeds.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand harsh environmental conditions and high-power applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a short maximum time at peak reflow temperature, this FET is easy to solder and less prone to damage during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this FET can withstand the soldering process without experiencing thermal stress or damage.

Technical Specifications

Power Field Effect Transistors (FET) NVMFD5853NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

53 A

Maximum Drain Current (ID):

53 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFD5853NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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