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NVH820S75L4SPC

Onsemi

NVH820S75L4SPC by Onsemi

NVH820S75L4SPC by Onsemi is an N-CHANNEL IGBT with 750V VCEsat, 820A IC, and 1354ns toff. Ideal for POWER CONTROL applications, it features a CERAMIC, METAL-SEALED COFIRED package body and operates b/w -40 °C to 175°C.

Median Price

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Lifecycle Status

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Overview

Unlock the power of efficiency and reliability with the NVH820S75L4SPC by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are perfect for power control applications. The NVH820S75L4SPC offers customers unmatched value with its complex configuration, N-Channel design, and maximum VCEsat of 1.55V. Experience seamless operation and superior performance with this product, providing you with the advantage you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material provides excellent thermal and electrical insulation properties, ensuring reliable performance in high-power applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically offer lower conduction losses and faster switching speeds compared to P-channel IGBTs, making them ideal for power control applications.

Maximum VCEsat: 1.55 V

The low saturation voltage of 1.55V minimizes power dissipation and improves efficiency in power control applications.

Maximum Collector-Emitter Voltage: 750 V

The high collector-emitter voltage rating of 750V allows for safe operation in high voltage environments, making this IGBT suitable for a wide range of power applications.

Maximum Collector Current (IC): 820 A

With a high collector current rating of 820A, this IGBT can handle large currents without compromising performance, making it suitable for high-power applications.

Nominal Turn Off Time (toff): 1354 ns

The relatively fast turn-off time of 1354ns allows for efficient switching and control of power flow, contributing to improved system performance.

Nominal Turn On Time (ton): 454 ns

The fast turn-on time of 454ns ensures quick response and precise control in power switching applications, enhancing overall system efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NVH820S75L4SPC attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

750 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.6 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-CUFM-X21

JESD-609 Code:

e3

No. of Elements:

6

No. of Terminals:

21

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1354 ns

Nominal Turn On Time (ton):

454 ns

Maximum VCEsat:

1.55 V

Trade Compliance

NVH820S75L4SPC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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