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NVBL0R5N04XC

Onsemi

NVBL0R5N04XC by Onsemi

NVBL0R5N04XC by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage and 300A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 1064mJ Avalanche Energy Rating, and operates in ENHANCEMENT MODE.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,339 parts In-Stock

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Vyrian

USA . 522 parts In-Stock

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Problanco Electronics

Mexico . 7,579 parts In-Stock

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Kulean Microsystems

USA . 2,438 parts In-Stock

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TANS Electronics

Latvia . 2,198 parts In-Stock

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Corphita

USA . 1,493 parts In-Stock

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SupplyDigital Components

Austria . 684 parts In-Stock

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UHIMA Technologies

Türkiye . 477 parts In-Stock

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Corohmni

South Africa . 62 parts In-Stock

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Overview

Experience the power of innovation with the NVBL0R5N04XC by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for switching applications. With a minimum DS breakdown voltage of 40V and a maximum drain current of 300A, this N-CHANNEL transistor offers exceptional performance and reliability. Whether you're looking to enhance your electronic designs or improve efficiency, the NVBL0R5N04XC provides the value and benefits you need to take your projects to the next level. Trust Onsemi for quality, trust NVBL0R5N04XC for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the Power FET, ensuring it can withstand harsh operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and can help protect against reverse voltage spikes, increasing the reliability of the system.

Transistor Application: SWITCHING

Designed for switching applications, this Power FET offers fast switching speeds and low ON resistance, making it ideal for power management and control.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40 V, this Power FET can handle high voltage applications effectively.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Maximum Drain Current (ID): 300 A

With a high maximum drain current rating, this Power FET can handle high power loads without overheating or failing.

Maximum Power Dissipation (Abs): 429 W

The high power dissipation rating ensures that the Power FET can handle large power levels without exceeding its thermal limits, increasing its reliability.

Avalanche Energy Rating (EAS): 1064 mJ

The high avalanche energy rating indicates that this Power FET can withstand high energy spikes, improving its ruggedness and longevity in demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) NVBL0R5N04XC attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1064 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

300 A

Maximum Drain Current (ID):

300 A

Maximum Drain-Source On Resistance:

.00057 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-299A

JESD-30 Code:

R-PSSO-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

215 ns

Maximum Turn On Time (ton):

221 ns

Trade Compliance

NVBL0R5N04XC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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