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NVBLS001N06C

Onsemi

NVBLS001N06C by Onsemi

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 284 W; Maximum Drain Current (Abs) (ID): 422 A; Moisture Sensitivity Level (MSL): 1;

Median Price

$10.516

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 49 parts In-Stock

1+ parts

$10.961

100+ parts

$6.253

1k+ parts

$6.253

10k+ parts

$6.253

49

$10.961

$6.253

$6.253

$6.253

Chip1Stop

Japan . 49 parts In-Stock

1+ parts

$11.165

100+ parts

$6.460

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-

10k+ parts

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49

$11.165

$6.460

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-

DigiKey

USA . 6,584 parts In-Stock

1+ parts

$12.030

100+ parts

$6.317

1k+ parts

$6.096

10k+ parts

$6.096

6,584

$12.030

$6.317

$6.096

$6.096

Mouser Electronics

USA . 4,440 parts In-Stock

1+ parts

$12.030

100+ parts

$6.970

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-

10k+ parts

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4,440

$12.030

$6.970

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-

Rochester

USA . 1,744 parts In-Stock

1+ parts

-

100+ parts

$6.080

1k+ parts

$5.440

10k+ parts

$5.120

1,744

-

$6.080

$5.440

$5.120

Verical

USA . 1,744 parts In-Stock

1+ parts

-

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$7.600

1k+ parts

$6.800

10k+ parts

$6.400

1,744

-

$7.600

$6.800

$6.400

Farnell

UK . 360 parts In-Stock

1+ parts

-

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$4.840

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-

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360

-

$4.840

-

-

Element14

Singapore . 360 parts In-Stock

1+ parts

-

100+ parts

$10.070

1k+ parts

$9.870

10k+ parts

-

360

-

$10.070

$9.870

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 892 parts In-Stock

1+ parts

$6.432

100+ parts

-

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892

$6.432

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Vyrian

USA . 1,932 parts In-Stock

1+ parts

$6.770

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1,932

$6.770

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Elcom Components

USA . 26 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,711 parts In-Stock

1+ parts

$5.750

100+ parts

-

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1,711

$5.750

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Corphita

USA . 1,502 parts In-Stock

1+ parts

$6.093

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1,502

$6.093

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Corohmni

South Africa . 224 parts In-Stock

1+ parts

$6.770

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224

$6.770

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Microchip USA

USA . 9,439 parts In-Stock

1+ parts

$18.815

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9,439

$18.815

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Perfect Parts

USA . 11,178 parts In-Stock

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11,178

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Problanco Electronics

Mexico . 7,873 parts In-Stock

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7,873

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Kulean Microsystems

USA . 6,136 parts In-Stock

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TANS Electronics

Latvia . 5,125 parts In-Stock

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Authorized Procurement Solutions

USA . 1,820 parts In-Stock

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1,820

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SupplyDigital Components

Austria . 1,007 parts In-Stock

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1,007

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UHIMA Technologies

Türkiye . 513 parts In-Stock

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513

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Continental Prestige Electronics

USA . 486 parts In-Stock

1+ parts

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100+ parts

$5.460

1k+ parts

$4.310

10k+ parts

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486

-

$5.460

$4.310

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100

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Technical Specifications

Power Field Effect Transistors (FET) NVBLS001N06C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

760 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

422 A

Maximum Drain Current (ID):

422 A

Maximum Drain-Source On Resistance:

.0009 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

76 pF

JESD-30 Code:

R-PSSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVBLS001N06C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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