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NVBLS0D5N04M8TXG

Onsemi

NVBLS0D5N04M8TXG by Onsemi

NVBLS0D5N04M8TXG by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage and 300A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, operates in ENHANCEMENT MODE, and has a max power dissipation of 429W.

Median Price

$2.763

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,491 parts In-Stock

1+ parts

-

100+ parts

$2.370

1k+ parts

$2.120

10k+ parts

$1.990

3,491

-

$2.370

$2.120

$1.990

DigiKey

USA . 3,491 parts In-Stock

1+ parts

-

100+ parts

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$2.860

10k+ parts

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3,491

-

-

$2.860

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Verical

USA . 2,839 parts In-Stock

1+ parts

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$2.763

10k+ parts

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2,839

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$2.763

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Flip Electronics (Authorized)

USA . 2,000 parts In-Stock

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2,000

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Distributors (In-Stock)

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Vyrian

USA . 1,420 parts In-Stock

1+ parts

$2.050

100+ parts

-

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1,420

$2.050

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Digiode

USA . 938 parts In-Stock

1+ parts

$2.612

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938

$2.612

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Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

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2,000

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ACDS - Activité Composants Distribution Service

France . 1,950 parts In-Stock

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Bristol Electronics

USA . 1,950 parts In-Stock

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1,950

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Dan-Mar Components

USA . 1,950 parts In-Stock

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1,950

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Distributors (Availability)

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$1.293

100+ parts

$1.177

1k+ parts

$1.060

10k+ parts

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200

$1.293

$1.177

$1.060

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Corohmni

South Africa . 388 parts In-Stock

1+ parts

$2.050

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388

$2.050

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Corphita

USA . 286 parts In-Stock

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$2.475

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286

$2.475

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Component Stockers USA

USA . 3,823 parts In-Stock

1+ parts

$2.820

100+ parts

$2.660

1k+ parts

$2.400

10k+ parts

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3,823

$2.820

$2.660

$2.400

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QUARKTWIN TECHNOLOGY LTD

USA . 8,885 parts In-Stock

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Kulean Microsystems

USA . 8,251 parts In-Stock

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Problanco Electronics

Mexico . 4,815 parts In-Stock

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SupplyDigital Components

Austria . 4,365 parts In-Stock

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TANS Electronics

Latvia . 3,485 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Continental Prestige Electronics

USA . 2,839 parts In-Stock

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$2.050

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2,839

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Microchip USA

USA . 2,295 parts In-Stock

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2,295

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UHIMA Technologies

Türkiye . 973 parts In-Stock

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973

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Overview

Unleash the power of innovation with the NVBLS0D5N04M8TXG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors designed for switching applications. This N-CHANNEL transistor offers a single configuration with a built-in diode, providing enhanced performance and reliability. With a maximum drain current of 300A and a low drain-source on resistance of 0.00057 ohm, this transistor is ideal for high-power applications. Experience the efficiency and durability that Onsemi products bring to your projects with the NVBLS0D5N04M8TXG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the transistor, increasing durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower resistance compared to P-channel FETs, making them suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient reverse flyback protection in the circuit, preventing damage to the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high efficiency and low power loss during operation.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and enabling high-density designs.

Minimum DS Breakdown Voltage: 40 V

Provides a safety margin for voltage surges and spikes, protecting the transistor from damage in high voltage applications.

Maximum Drain Current (Abs) (ID): 300 A

Capable of handling high current loads, making it suitable for power electronics applications.

Maximum Power Dissipation (Abs): 429 W

Ability to dissipate high levels of power without overheating, ensuring reliable performance under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced MOSFET technology for improved efficiency, speed, and performance in various applications.

Maximum Operating Temperature: 175 °C

Can operate effectively in high temperature environments, ensuring stable performance in tough conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVBLS0D5N04M8TXG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1064 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

300 A

Maximum Drain Current (ID):

300 A

Maximum Drain-Source On Resistance:

.00057 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-299A

JESD-30 Code:

R-PSSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

215 ns

Maximum Turn On Time (ton):

221 ns

Trade Compliance

NVBLS0D5N04M8TXG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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