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NVBLS0D7N04M8TXG

Onsemi

NVBLS0D7N04M8TXG by Onsemi

NVBLS0D7N04M8TXG by Onsemi is a Power FET with N-CHANNEL polarity, 40V DS breakdown voltage, and 240A max drain current. Ideal for applications requiring high power dissipation in small outline packages, such as automotive electronics or industrial control systems.

Median Price

$2.090

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 24,000 parts In-Stock

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$2.090

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$2.090

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$2.090

Flip Electronics (Authorized)

USA . 24,000 parts In-Stock

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Distributors (In-Stock)

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Vyrian

USA . 278 parts In-Stock

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$2.090

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278

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Flip Electronics

USA . 24,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,000 parts In-Stock

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Bristol Electronics

USA . 1,990 parts In-Stock

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1,990

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Dan-Mar Components

USA . 1,990 parts In-Stock

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Digiode

USA . 1,641 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$0.938

100+ parts

$0.854

1k+ parts

$0.769

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600

$0.938

$0.854

$0.769

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Corohmni

South Africa . 315 parts In-Stock

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$2.090

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315

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Microchip USA

USA . 186 parts In-Stock

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$20.540

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Problanco Electronics

Mexico . 7,985 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 4,425 parts In-Stock

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Perfect Parts

USA . 3,797 parts In-Stock

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Kulean Microsystems

USA . 1,221 parts In-Stock

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Corphita

USA . 887 parts In-Stock

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UHIMA Technologies

Türkiye . 724 parts In-Stock

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SupplyDigital Components

Austria . 487 parts In-Stock

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Overview

Discover the unparalleled performance and reliability of the NVBLS0D7N04M8TXG by Onsemi, a top-tier manufacturer in the field of Power Field Effect Transistors. With its N-CHANNEL configuration and built-in diode, this product is perfect for a wide range of applications. From automotive to industrial settings, this transistor offers customers maximum power dissipation, enhanced energy efficiency, and quick turn-on/off times. Trust in Onsemi's cutting-edge technology and superior quality to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower on-resistance compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency of the FET in certain applications.

Surface Mount: YES

Allows for easy and convenient installation on PCBs.

Minimum DS Breakdown Voltage: 40 V

Ensures reliable operation under high voltage conditions.

Avalanche Energy Rating (EAS): 737 mJ

Can handle high levels of energy dissipation, making it suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 240 A

Capable of handling high current loads efficiently.

Maximum Power Dissipation (Abs): 357 W

Can dissipate heat effectively, allowing for continuous high-power operation.

Maximum Operating Temperature: 175 °C

Can operate reliably in high-temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) NVBLS0D7N04M8TXG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

737 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

240 A

Maximum Drain Current (ID):

240 A

Maximum Drain-Source On Resistance:

.00075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

440 pF

JEDEC-95 Code:

MO-299A

JESD-30 Code:

R-PSSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

279 ns

Maximum Turn On Time (ton):

162 ns

Trade Compliance

NVBLS0D7N04M8TXG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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