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NVBLS0D7N06C

Onsemi

NVBLS0D7N06C by Onsemi

NVBLS0D7N06C by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 900A IDM, 800mJ EAS, and 0.00075 ohm RDS(on). Operating from -55 to 175 °C, it has a small outline package style and meets AEC-Q101 standard.

Median Price

$13.780

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 412 parts In-Stock

1+ parts

$13.780

100+ parts

$9.410

1k+ parts

$8.500

10k+ parts

$8.320

412

$13.780

$9.410

$8.500

$8.320

DigiKey

USA . 46 parts In-Stock

1+ parts

$13.780

100+ parts

-

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-

10k+ parts

$7.273

46

$13.780

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-

$7.273

Distributors (In-Stock)

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Digiode

USA . 998 parts In-Stock

1+ parts

$13.091

100+ parts

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998

$13.091

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Vyrian

USA . 6,528 parts In-Stock

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6,528

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Flip Electronics

USA . 2,000 parts In-Stock

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2,000

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Distributors (Availability)

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Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$1.482

100+ parts

$1.349

1k+ parts

$1.215

10k+ parts

-

270

$1.482

$1.349

$1.215

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Corphita

USA . 175 parts In-Stock

1+ parts

$12.402

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175

$12.402

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Corohmni

South Africa . 389 parts In-Stock

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$14.200

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389

$14.200

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Microchip USA

USA . 9,748 parts In-Stock

1+ parts

$22.104

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9,748

$22.104

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Kulean Microsystems

USA . 8,149 parts In-Stock

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8,149

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TANS Electronics

Latvia . 7,273 parts In-Stock

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7,273

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Problanco Electronics

Mexico . 6,743 parts In-Stock

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6,743

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SupplyDigital Components

Austria . 4,486 parts In-Stock

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4,486

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UHIMA Technologies

Türkiye . 176 parts In-Stock

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176

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Overview

Power up your applications with the NVBLS0D7N06C by Onsemi, a top-quality N-channel Power FET designed for switching operations. With a maximum DS breakdown voltage of 60V and a maximum pulsed drain current of 900A, this transistor delivers powerful performance in a small outline package. From its silicon element material to its matte tin finish, every detail is crafted for reliability and efficiency. Whether you're working on automotive electronics or industrial controls, trust the NVBLS0D7N06C to deliver the power you need. Experience the difference with Onsemi's innovative technology and enhance your applications today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FET, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making them suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse bias protection, making this FET an efficient choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high performance and reliability in a variety of circuit designs.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and costs during manufacturing.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle high voltage loads and ensure reliable operation in demanding conditions.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed drain current rating of 900A allows for reliable operation in applications that require high current handling capabilities.

Avalanche Energy Rating (EAS): 800 mJ

With an avalanche energy rating of 800mJ, this FET can withstand high energy spikes and transient conditions without damage.

Maximum Power Dissipation (Abs): 314 W

The high power dissipation rating of 314W ensures that the FET can handle high power loads without overheating, ensuring stable operation.

Maximum Drain-Source On Resistance: 0.00075 ohm

The low on-resistance of 0.00075 ohm results in reduced power losses and improved efficiency in switching applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can operate reliably in high temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NVBLS0D7N06C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

470 A

Maximum Drain Current (ID):

470 A

Maximum Drain-Source On Resistance:

.00075 ohm

Field Effect Transistor Technology:

METAL SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

92 pF

JEDEC-95 Code:

MO-299A

JESD-30 Code:

R-PSSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVBLS0D7N06C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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