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NVATS68301PZT4G

Onsemi

NVATS68301PZT4G by Onsemi

The Onsemi NVATS68301PZT4G is a P-CHANNEL FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 124A and EAS of 54mJ, operating in ENHANCEMENT MODE. With a -55 to 175 °C temperature range, this MOSFET offers 0.075 ohm RDS(on) for efficient power management.

Median Price

$1.435

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 2,014 parts In-Stock

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$1.370

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Rochester

USA . 1,533 parts In-Stock

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$1.500

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$1.250

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$1.110

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$1.110

Flip Electronics (Authorized)

USA . 1,214 parts In-Stock

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Vyrian

USA . 246 parts In-Stock

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$1.370

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Flip Electronics

USA . 328 parts In-Stock

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Digiode

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ComSIT Distribution GmbH

Germany . 276 parts In-Stock

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Corohmni

South Africa . 329 parts In-Stock

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$1.370

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Component Stockers USA

USA . 361 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 8,121 parts In-Stock

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Perfect Parts

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Corphita

USA . 1,492 parts In-Stock

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Problanco Electronics

Mexico . 1,428 parts In-Stock

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SupplyDigital Components

Austria . 1,252 parts In-Stock

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TANS Electronics

Latvia . 1,198 parts In-Stock

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UHIMA Technologies

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GreenTree Electronics

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Overview

Unleash the power of innovation with the NVATS68301PZT4G by Onsemi, a top-tier manufacturer renowned for its cutting-edge Power Field Effect Transistors (FET). This P-CHANNEL transistor offers unparalleled quality and reliability, making it ideal for various switching applications. With a built-in diode and an impressive minimum DS Breakdown Voltage of 100V, this transistor ensures optimal performance in enhancement mode. Experience seamless operation and robust functionality with the NVATS68301PZT4G, delivering exceptional value and unmatched benefits to all customers. Elevate your projects to new heights with this high-performance transistor from Onsemi!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, increasing the reliability of the product.

Polarity or Channel Type: P-CHANNEL

Suitable for applications where P-channel FETs are required, offering flexibility in circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by including a built-in diode, saving space and reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in power control.

Minimum DS Breakdown Voltage: 100 V

Provides a high breakdown voltage, making the FET suitable for applications requiring voltage handling capabilities.

Surface Mount: YES

Allows for easy and efficient PCB assembly, reducing production time and costs.

Maximum Pulsed Drain Current (IDM): 124 A

Capable of handling high peak currents, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 54 mJ

Withstands high energy spikes, enhancing the robustness of the FET in harsh operating conditions.

Maximum Drain Current (ID): 31 A

Capable of conducting high continuous currents, making it reliable for sustained operation.

Maximum Drain-Source On Resistance: 0.075 ohm

Low on-resistance minimizes power losses and improves efficiency in power management applications.

Technical Specifications

Power Field Effect Transistors (FET) NVATS68301PZT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

54 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

31 A

Maximum Drain-Source On Resistance:

.075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

124 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVATS68301PZT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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