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NVATS4A101PZT4G

Onsemi

NVATS4A101PZT4G by Onsemi

NVATS4A101PZT4G by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 81A IDM, 25mJ EAS, and 0.03ohm RDS(ON), operating in the -55 to 175 °C temperature range. Suitable for automotive use (AEC-Q101) due to its robust design and high power dissipation of 36W.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,334 parts In-Stock

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Digiode

USA . 1,166 parts In-Stock

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AZTECH Wire

Italy . 491 parts In-Stock

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$19.740

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491

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Problanco Electronics

Mexico . 7,209 parts In-Stock

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SupplyDigital Components

Austria . 6,992 parts In-Stock

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TANS Electronics

Latvia . 3,587 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 2,092 parts In-Stock

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Kulean Microsystems

USA . 956 parts In-Stock

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Corohmni

South Africa . 162 parts In-Stock

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UHIMA Technologies

Türkiye . 108 parts In-Stock

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Overview

Discover the power of the NVATS4A101PZT4G by Onsemi, a top-quality P-CHANNEL Power FET designed for high-performance switching applications. With Onsemi's reputation for excellence in semiconductor manufacturing, this transistor offers reliability and efficiency like no other. Ideal for a wide range of electronic devices, customers can benefit from its enhanced mode operation, high drain current capacity, and low on-resistance. Upgrade your projects with the NVATS4A101PZT4G and experience unparalleled value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and heat-resistant, making the product suitable for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs have lower ON-resistance compared to N-channel FETs, providing better efficiency in certain applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching while providing reverse current protection, enhancing overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and fast performance in various electronic circuits.

Surface Mount: YES

Surface mount technology allows for easier and more automated PCB assembly, reducing production costs and improving overall manufacturing efficiency.

Maximum Pulsed Drain Current (IDM): 81 A

The high pulsed drain current rating enables the product to handle sudden spikes in current without damage, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 36 W

With a high power dissipation rating, this product can handle higher levels of power without overheating, ensuring reliable operation under heavy loads.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the product to perform reliably in harsh environments where temperature fluctuations are common.

Technical Specifications

Power Field Effect Transistors (FET) NVATS4A101PZT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

25 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

81 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVATS4A101PZT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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