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NVATS4A103PZT4G

Onsemi

NVATS4A103PZT4G by Onsemi

NVATS4A103PZT4G by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 180A IDM and 0.013 ohm RDS(ON), suitable for high-power operations. With a compact SMALL OUTLINE package and -55 to 175 °C operating range, it meets AEC-Q101 standards for automotive use.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,626 parts In-Stock

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Digiode

USA . 1,888 parts In-Stock

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AZTECH Wire

Italy . 1,052 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 4,564 parts In-Stock

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Kulean Microsystems

USA . 3,333 parts In-Stock

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Corphita

USA . 2,499 parts In-Stock

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SupplyDigital Components

Austria . 343 parts In-Stock

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TANS Electronics

Latvia . 191 parts In-Stock

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Corohmni

South Africa . 165 parts In-Stock

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UHIMA Technologies

Türkiye . 158 parts In-Stock

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Overview

Upgrade your power systems with the NVATS4A103PZT4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for switching applications. With a single configuration and built-in diode, this P-Channel transistor offers enhanced performance and reliability. Experience the benefits of high power dissipation, low on resistance, and a wide operating temperature range. Trust Onsemi to provide you with innovative solutions for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Polarity or Channel Type: P-CHANNEL

P-channel type allows for more efficient power management and lower power consumption.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and saves space on the PCB.

Transistor Application: SWITCHING

Designed specifically for switching applications, offering high efficiency and fast response times.

Surface Mount: YES

Surface mount capability makes for easy and convenient installation on the PCB.

Minimum DS Breakdown Voltage: 30 V

With a breakdown voltage of 30V, this FET provides reliable operation within specified limits.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and reliability in solder joints.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables easy control of the transistor with low input voltage.

Maximum Pulsed Drain Current (IDM): 180 A

High pulsed drain current capability allows for handling of peak loads with ease.

Avalanche Energy Rating (EAS): 57 mJ

High avalanche energy rating ensures robust performance under transient conditions.

Maximum Drain Current (Abs) (ID): 60 A

With a maximum drain current of 60A, this FET can handle high power applications.

No. of Terminals: 2

Having 2 terminals simplifies the installation and circuit layout.

Maximum Power Dissipation (Abs): 60 W

High power dissipation capability ensures reliable operation under high load conditions.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for high-density layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in power applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows for operation in harsh environments.

Transistor Element Material: SILICON

Silicon material provides good thermal conductivity and high temperature handling capability.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature makes it suitable for a wide range of operating conditions.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish ensures good solderability and reliability.

Maximum Drain-Source On Resistance: 0.013 ohm

Low drain-source on resistance ensures minimal power loss and efficient operation.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection in the circuit.

Case Connection: DRAIN

Drain case connection provides good thermal performance and ease of heat dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30s, ensures reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

260 °C peak reflow temperature allows for high-temperature soldering without damaging the component.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVATS4A103PZT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

57 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

180 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVATS4A103PZT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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