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NVATS5A304PLZT4G

Onsemi

NVATS5A304PLZT4G by Onsemi

NVATS5A304PLZT4G by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 480A IDM, 656mJ EAS, and 0.0089 ohm Drain-Source On Resistance. With a max power dissipation of 108W and operating temperature range from -55 to 175 °C, it is suitable for high-power switching applications in automotive electronics.

Median Price

$2.513

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$2.580

100+ parts

$2.310

1k+ parts

$2.270

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1

$2.580

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$2.270

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Rochester

USA . 1,529 parts In-Stock

1+ parts

-

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$2.240

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$2.010

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$1.890

1,529

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$2.240

$2.010

$1.890

Verical

USA . 1,529 parts In-Stock

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$2.513

10k+ parts

$2.362

1,529

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$2.513

$2.362

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Digiode

USA . 104 parts In-Stock

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$2.375

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$2.375

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Vyrian

USA . 3,131 parts In-Stock

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Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$1.844

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$1.678

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$1.512

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870

$1.844

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$1.512

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Corphita

USA . 2,444 parts In-Stock

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$2.250

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$2.250

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Corohmni

South Africa . 407 parts In-Stock

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$2.500

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AZTECH Wire

Italy . 846 parts In-Stock

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$10.880

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$10.880

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Perfect Parts

USA . 35,305 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Kulean Microsystems

USA . 2,543 parts In-Stock

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SupplyDigital Components

Austria . 2,416 parts In-Stock

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Problanco Electronics

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TANS Electronics

Latvia . 2,224 parts In-Stock

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UHIMA Technologies

Türkiye . 232 parts In-Stock

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Overview

Upgrade your power switching capabilities with the NVATS5A304PLZT4G by Onsemi. Crafted with precision and expertise, Onsemi's Power Field Effect Transistor (FET) offers superior performance and reliability in a compact rectangular package. Ideal for a range of applications, this P-CHANNEL transistor with a built-in diode is designed to enhance your systems' efficiency and effectiveness. With a maximum drain current of 120 A and minimum DS breakdown voltage of 60 V, this FET provides exceptional power dissipation and performance. Trust Onsemi to deliver quality products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their lower on-resistance compared to N-channel FETs, making them more efficient for certain applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse current flow, enhancing the overall performance of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast switching speeds and high efficiency.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage of 60V ensures that the FET can handle high voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 480 A

With a high pulsed drain current rating, this FET can handle large current spikes without being damaged, making it reliable under demanding conditions.

Maximum Power Dissipation (Abs): 108 W

The high power dissipation rating indicates that this FET can handle high power loads without overheating, ensuring stable operation in high-power applications.

Maximum Drain Current (ID): 120 A

This FET can sustain a continuous drain current of 120A, making it suitable for high-current applications such as motor control or power supplies.

Maximum Drain-Source On Resistance: 0.0089 ohm

The low on-resistance of 0.0089 ohms reduces power losses and improves efficiency, making this FET ideal for high-current switching applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range of 175 °C, this FET can operate in high-temperature environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) NVATS5A304PLZT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

656 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0089 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVATS5A304PLZT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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