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NVATS5A112PLZT4G

Onsemi

NVATS5A112PLZT4G by Onsemi

NVATS5A112PLZT4G by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 81A IDM, 50mJ EAS, and 0.043 ohm RDS(ON). Package: PLASTIC/EPOXY, GULL WING terminals, AEC-Q101 compliant.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 7,740 parts In-Stock

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Flip Electronics

USA . 3,000 parts In-Stock

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Digiode

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Greenchips

USA . 643 parts In-Stock

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AZTECH Wire

Italy . 449 parts In-Stock

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$9.640

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Perfect Parts

USA . 411,718 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 5,297 parts In-Stock

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TANS Electronics

Latvia . 3,967 parts In-Stock

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SupplyDigital Components

Austria . 3,663 parts In-Stock

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Corphita

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Infinite Electronics LLP (Excess)

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Kulean Microsystems

USA . 889 parts In-Stock

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UHIMA Technologies

Türkiye . 401 parts In-Stock

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Corohmni

South Africa . 173 parts In-Stock

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Overview

Discover the power of the NVATS5A112PLZT4G by Onsemi, a top-tier manufacturer known for their high-quality Power Field Effect Transistors (FET). Designed with a P-Channel configuration and built-in diode, this transistor is ideal for switching applications. With a maximum pulsed drain current of 81A and a minimum DS breakdown voltage of 60V, this device offers unmatched performance and reliability. Whether you're looking to enhance your electronic projects or streamline your operations, the NVATS5A112PLZT4G delivers exceptional value and benefits that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: P-CHANNEL

P-Channel polarity allows for efficient current flow and low power consumption, making this FET suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and increases efficiency by minimizing voltage spikes and protecting the FET from reverse polarity.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides high-speed operation and efficient power handling capabilities.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on circuit boards, saving space and allowing for automated assembly processes.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle high voltage applications with reliability and safety.

Package Shape: RECTANGULAR

Rectangular package shape allows for convenient placement and mounting on circuit boards, optimizing space usage and assembly efficiency.

Terminal Form: GULL WING

Gull Wing terminal form provides robust mechanical support and easy soldering connections, ensuring a secure and stable electrical connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers precise control over the FET's conductivity, allowing for efficient power management and performance optimization.

Maximum Pulsed Drain Current (IDM): 81 A

High maximum pulsed drain current rating of 81A enables the FET to handle momentary power surges and peak loads without the risk of overheating or failure.

Avalanche Energy Rating (EAS): 50 mJ

Avalanche energy rating of 50mJ ensures the FET can withstand short-duration high-energy pulses, preventing damage and improving overall reliability.

No. of Terminals: 2

Two terminals simplify the connection and integration of the FET into circuit designs, reducing complexity and potential points of failure.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards and facilitates compact designs without compromising on performance or functionality.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology enhances the FET's switching speed, power efficiency, and thermal performance, making it ideal for various applications.

Transistor Element Material: SILICON

Silicon transistor element material offers high conductivity, reliability, and temperature stability, ensuring consistent performance under varying operating conditions.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish provides good solderability and long-term reliability, ensuring secure electrical connections and resistance to corrosion.

Maximum Drain Current (ID): 27 A

High maximum drain current rating of 27A enables the FET to handle continuous power loads with efficiency and reliability, suitable for demanding applications.

Maximum Drain-Source On Resistance: 0.043 ohm

Low maximum drain-source on resistance of 0.043 ohms reduces power loss and heat generation, improving overall efficiency and performance.

Terminal Position: SINGLE

Single terminal position simplifies installation and circuit layout, ensuring easy integration and reliable operation in various electronic designs.

Case Connection: DRAIN

Drain case connection provides efficient cooling and thermal dissipation, safeguarding the FET against overheating and ensuring long-term reliability.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and prevents thermal damage during the assembly process.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C allows for efficient soldering and ensures secure connections without compromising the FET's performance or reliability.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 automotive standard ensures high quality, reliability, and durability, making this FET suitable for automotive and other demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) NVATS5A112PLZT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

50 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

81 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVATS5A112PLZT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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