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NVATS5A114PLZT4G

Onsemi

NVATS5A114PLZT4G by Onsemi

NVATS5A114PLZT4G by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 180A IDM and 0.016 ohm RDS(ON), suitable for high-power operations. With a small outline package and AEC-Q101 standard, it ensures reliable performance in automotive electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Flip Electronics

USA . 6,000 parts In-Stock

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Vyrian

USA . 5,343 parts In-Stock

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Digiode

USA . 2,154 parts In-Stock

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AZTECH Wire

Italy . 714 parts In-Stock

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$8.300

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Component Stockers USA

USA . 595 parts In-Stock

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$99.990

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Perfect Parts

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TANS Electronics

Latvia . 8,175 parts In-Stock

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Problanco Electronics

Mexico . 7,802 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,272 parts In-Stock

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Kulean Microsystems

USA . 3,896 parts In-Stock

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SupplyDigital Components

Austria . 3,823 parts In-Stock

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Authorized Procurement Solutions

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Corohmni

South Africa . 362 parts In-Stock

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UHIMA Technologies

Türkiye . 332 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the NVATS5A114PLZT4G by Onsemi, a cutting-edge P-channel Power FET designed for high-performance switching applications. Manufactured with precision and expertise by Onsemi, this transistor offers unparalleled reliability and efficiency. Whether you're looking to optimize your power management systems or enhance the performance of your electronic devices, this FET is the ultimate solution. Say goodbye to inefficiencies and hello to seamless operation with the NVATS5A114PLZT4G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this FET lightweight and durable, ideal for portable electronic devices.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high current-carrying capability, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode in the FET allows for more efficient switching operations and helps protect against reverse current flow, improving overall system reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power losses, making it an efficient choice for power management circuits.

Maximum Power Dissipation (Abs): 72 W

With a high maximum power dissipation rating of 72W, this FET can handle high power levels without overheating, ensuring reliable performance in demanding conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVATS5A114PLZT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

180 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVATS5A114PLZT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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