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NTZD3155CT2H

Onsemi

NTZD3155CT2H by Onsemi

NTZD3155CT2H by Onsemi is a Small Signal FET with N/P-Channel types, ideal for switching applications. It features 20V DS breakdown voltage, 0.54A max drain current, and 0.55 ohm max on-resistance. With a package style of small outline and operating temperature up to 150 °C, it's suitable for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 850 parts In-Stock

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850

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Digiode

USA . 514 parts In-Stock

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Kulean Microsystems

USA . 8,230 parts In-Stock

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Problanco Electronics

Mexico . 7,630 parts In-Stock

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SupplyDigital Components

Austria . 2,107 parts In-Stock

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TANS Electronics

Latvia . 1,389 parts In-Stock

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Corohmni

South Africa . 487 parts In-Stock

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Corphita

USA . 356 parts In-Stock

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UHIMA Technologies

Türkiye . 34 parts In-Stock

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Overview

Enhance your electronic projects with the NTZD3155CT2H by Onsemi, a high-quality Small Signal Field Effect Transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a leading name in the industry known for its cutting-edge technology and innovation, this transistor is perfect for switching applications. With its N-Channel and P-Channel polarity, separate configuration, and built-in diode, this transistor provides unmatched versatility and efficiency. Experience the value and benefits of this powerful component, from its maximum drain current of 0.54 A to its low on-resistance of 0.55 ohm. Upgrade your designs with Onsemi's NTZD3155CT2H and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Having both N-channel and P-channel types allows for versatility in designing circuits with different requirements.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The built-in diode enhances circuit protection and efficiency, making the transistor a reliable choice.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers fast response times and efficient performance.

Surface Mount: YES

The surface mount option simplifies the installation process and saves space on the circuit board.

Minimum DS Breakdown Voltage: 20 V

With a high breakdown voltage, this transistor can handle higher voltages in circuits, increasing its reliability.

Maximum Drain Current (Abs) (ID): 0.54 A

Capable of handling up to 0.54 A of current, this transistor can be used in a variety of low to moderate power applications.

Maximum Power Dissipation (Abs): 0.25 W

With a low power dissipation, this transistor operates efficiently and can help reduce energy consumption.

Maximum Operating Temperature: 150 °C

Suitable for a wide range of operating temperatures, this transistor can be used in various environments without compromising performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTZD3155CT2H attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.54 A

Maximum Drain Current (ID):

.54 A

Maximum Drain-Source On Resistance:

.55 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

20 pF

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTZD3155CT2H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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