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NTZD3152PT1H

Onsemi

NTZD3152PT1H by Onsemi

NTZD3152PT1H by Onsemi is a P-CHANNEL FET with 2 elements and built-in diode, ideal for switching applications. It features a min DS breakdown voltage of 20V, max drain current of 0.43A, and max power dissipation of 0.28W. This small outline transistor operates in enhancement mode with a max temp of 150 °C.

Median Price

$0.102

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 342,853 parts In-Stock

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-

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$0.090

342,853

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$0.090

Farnell

UK . 342,853 parts In-Stock

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$0.110

342,853

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$0.110

Rochester

USA . 342,303 parts In-Stock

1+ parts

-

100+ parts

$0.106

1k+ parts

$0.088

10k+ parts

$0.078

342,303

-

$0.106

$0.088

$0.078

Verical

USA . 134,212 parts In-Stock

1+ parts

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$0.098

134,212

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$0.098

Distributors (In-Stock)

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Digiode

USA . 710 parts In-Stock

1+ parts

$0.083

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710

$0.083

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Vyrian

USA . 1,400 parts In-Stock

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$0.087

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1,400

$0.087

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Prism Electronics

USA . 85 parts In-Stock

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85

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Distributors (Availability)

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Corohmni

South Africa . 472 parts In-Stock

1+ parts

$0.078

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472

$0.078

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Corphita

USA . 1,182 parts In-Stock

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$0.078

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$0.078

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Component Stockers USA

USA . 420,086 parts In-Stock

1+ parts

$0.090

100+ parts

$0.080

1k+ parts

$0.070

10k+ parts

$0.070

420,086

$0.090

$0.080

$0.070

$0.070

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$0.425

100+ parts

$0.387

1k+ parts

$0.348

10k+ parts

-

1,000

$0.425

$0.387

$0.348

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Continental Prestige Electronics

USA . 342,853 parts In-Stock

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$0.084

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342,853

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$0.084

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Kepictronics

USA . 40,188 parts In-Stock

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Perfect Parts

USA . 26,975 parts In-Stock

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Kulean Microsystems

USA . 8,072 parts In-Stock

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Problanco Electronics

Mexico . 4,196 parts In-Stock

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SupplyDigital Components

Austria . 3,648 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,365 parts In-Stock

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UHIMA Technologies

Türkiye . 98 parts In-Stock

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98

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Overview

Discover the innovative NTZD3152PT1H by Onsemi, a high-quality P-Channel Small Signal Field Effect Transistor ideal for switching applications. With its separate configuration and built-in diode, this transistor offers exceptional performance and reliability. From its compact package shape to its maximum power dissipation of 0.28 W, this product is designed to exceed expectations. Trust Onsemi's expertise in semiconductor technology and unlock the potential of your devices with the NTZD3152PT1H. Elevate your projects with this cutting-edge solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good insulation and protection for the transistor, ensuring durability and reliability in various operating conditions.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low on-resistance and high current-carrying capability, making this transistor suitable for switching applications where low resistance and high efficiency are desired.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having 2 separate elements with a built-in diode allows for more flexibility and functionality in circuit design, making this transistor ideal for applications that require complex switching operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low on-resistance, making it a reliable choice for various electronic devices and circuits.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving space on the circuit board and allowing for automated assembly processes, which is beneficial in high-volume production.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltages without compromising its performance, ensuring safe and reliable operation in various applications.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and allows for easy placement on the circuit board, making it suitable for compact electronic devices or applications where space is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance, low power consumption, and improved reliability, making this transistor a cost-effective and efficient solution for various circuit designs.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand elevated temperatures without compromising its performance, making it suitable for applications that require extended operation in high-temperature environments.

Maximum Power Dissipation (Abs): 0.28 W

The maximum power dissipation of 0.28W ensures that the transistor can handle sufficient power without overheating, making it a reliable choice for applications that require high power handling capability.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTZD3152PT1H attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ESD PROTECTION, LOW THRESHOLD

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.43 A

Maximum Drain Current (ID):

.43 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

20 pF

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTZD3152PT1H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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