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NTTFS6H854NTAG

Onsemi

NTTFS6H854NTAG by Onsemi

NTTFS6H854NTAG by Onsemi is a Power FET with 80V DS Breakdown Voltage, 175A IDM, and 0.0231 ohm RDS(on). It is an N-CHANNEL MOSFET in a PLASTIC/EPOXY package ideal for power management applications requiring high current handling capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 6,000 parts In-Stock

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Vyrian

USA . 4,340 parts In-Stock

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Digiode

USA . 1,460 parts In-Stock

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1,460

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Distributors (Availability)

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AZTECH Wire

Italy . 987 parts In-Stock

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$21.770

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987

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TANS Electronics

Latvia . 7,436 parts In-Stock

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Problanco Electronics

Mexico . 5,086 parts In-Stock

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SupplyDigital Components

Austria . 4,842 parts In-Stock

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Kulean Microsystems

USA . 3,649 parts In-Stock

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Corphita

USA . 2,497 parts In-Stock

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UHIMA Technologies

Türkiye . 324 parts In-Stock

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Corohmni

South Africa . 250 parts In-Stock

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Overview

Unlock the power of innovation with the NTTFS6H854NTAG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are designed to exceed expectations. Whether you're in need of enhanced performance, reliability, or efficiency, this N-CHANNEL FET with a built-in diode has got you covered. Perfect for a wide range of applications, this transistor offers unmatched value and benefits to customers looking to elevate their projects to the next level. Trust Onsemi to deliver cutting-edge technology that empowers you to achieve more.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FET, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics than P-channel FETs, making this product a good choice for efficiency and power handling.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current, making the FET more versatile and reliable.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and offer better performance in switching applications, making this product ideal for high frequency operations.

Maximum Drain Current (ID): 9.5 A

With a high maximum drain current rating, this FET can handle high power loads with ease.

Maximum Power Dissipation (Abs): 68 W

The high power dissipation capability allows the FET to handle heavy loads without overheating, ensuring reliable operation.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS6H854NTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

205 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

9.5 A

Maximum Drain Current (ID):

9.5 A

Maximum Drain-Source On Resistance:

.0231 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5.4 pF

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

175 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTTFS6H854NTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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