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NTTFS4H05NTWG

Onsemi

NTTFS4H05NTWG by Onsemi

NTTFS4H05NTWG by Onsemi is a power FET with N-channel configuration and built-in diode, ideal for switching applications. It features a max pulsed drain current of 304A, avalanche energy rating of 84mJ, and max operating temperature of 150°C. This MOSFET has a drain-source on resistance of 0.0048 ohm and can handle a max drain current of 22.4A efficiently in various electronic circuits.

Median Price

$0.766

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 227,616 parts In-Stock

1+ parts

-

100+ parts

$0.752

1k+ parts

$0.624

10k+ parts

$0.556

227,616

-

$0.752

$0.624

$0.556

Verical

USA . 207,616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.780

10k+ parts

$0.696

207,616

-

-

$0.780

$0.696

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 5,000 parts In-Stock

1+ parts

$0.390

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

$0.390

-

-

-

Digiode

USA . 1,828 parts In-Stock

1+ parts

$0.586

100+ parts

-

1k+ parts

-

10k+ parts

-

1,828

$0.586

-

-

-

Vyrian

USA . 3,897 parts In-Stock

1+ parts

-

100+ parts

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3,897

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-

-

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Distributors (Availability)

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Corphita

USA . 2,491 parts In-Stock

1+ parts

$0.555

100+ parts

-

1k+ parts

-

10k+ parts

-

2,491

$0.555

-

-

-

Corohmni

South Africa . 102 parts In-Stock

1+ parts

$0.617

100+ parts

-

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-

10k+ parts

-

102

$0.617

-

-

-

Microchip USA

USA . 126 parts In-Stock

1+ parts

$3.835

100+ parts

-

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-

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126

$3.835

-

-

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AZTECH Wire

Italy . 871 parts In-Stock

1+ parts

$13.920

100+ parts

-

1k+ parts

-

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871

$13.920

-

-

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Continental Prestige Electronics

USA . 237,616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.566

10k+ parts

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237,616

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-

$0.566

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Problanco Electronics

Mexico . 4,718 parts In-Stock

1+ parts

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4,718

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Kulean Microsystems

USA . 2,251 parts In-Stock

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2,251

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SupplyDigital Components

Austria . 772 parts In-Stock

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772

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TANS Electronics

Latvia . 660 parts In-Stock

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660

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UHIMA Technologies

Türkiye . 335 parts In-Stock

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335

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Overview

Upgrade your power systems with the NTTFS4H05NTWG by Onsemi, a top-tier Power Field Effect Transistor (FET) that offers unparalleled quality and reliability. With a single configuration and built-in diode, this transistor is perfect for switching applications, providing efficient performance and maximum power dissipation of 46.3W. Whether you're looking to enhance your system's efficiency or boost its overall performance, the NTTFS4H05NTWG delivers exceptional value and benefits that will exceed your expectations. Experience the advantages of Onsemi's cutting-edge technology and elevate your power systems to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in the specified direction, enhancing the FET's performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for improved efficiency and protection against reverse current flow, making it a reliable choice for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast and efficient operation.

Surface Mount: YES

Enables easy integration onto circuit boards, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 25 V

With a breakdown voltage of 25V, this FET can handle a range of voltage levels, making it versatile for different circuit requirements.

Package Shape: SQUARE

The square package shape allows for easier placement and soldering onto circuit boards, improving overall efficiency in manufacturing.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors provide better control over current flow, making the FET more responsive and efficient in various applications.

Maximum Pulsed Drain Current (IDM): 304 A

With a high pulsed drain current rating, this FET can handle sudden surges in current, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 84 mJ

The high avalanche energy rating ensures the FET can withstand sudden voltage spikes without damage, increasing reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 94 A

With a high drain current rating, this FET can handle continuous high current loads, making it suitable for power applications.

Maximum Power Dissipation (Abs): 46.3 W

The high power dissipation rating allows the FET to handle high power levels without overheating, ensuring stable operation.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance with low power consumption, making the FET energy-efficient.

Maximum Operating Temperature: 150 °C

With a high operating temperature range of 150°C, this FET can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon transistors offer high reliability and performance, making this FET a durable and long-lasting choice.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good conductivity and protection against corrosion, ensuring long-term reliability.

Maximum Drain Current (ID): 22.4 A

With a high drain current rating, this FET can handle heavy loads with ease, suitable for power applications.

Maximum Drain-Source On Resistance: 0.0048 ohm

The low drain-source on resistance results in minimal power losses and efficient current flow, improving overall performance.

Terminal Position: DUAL

The dual terminal position allows for versatile circuit connections, making it compatible with different circuit configurations.

Case Connection: DRAIN

The drain case connection simplifies the circuit layout and assembly process, making it user-friendly for electronics designers.

Technical Specifications

Power Field Effect Transistors (FET) NTTFS4H05NTWG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

84 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

94 A

Maximum Drain Current (ID):

22.4 A

Maximum Drain-Source On Resistance:

.0048 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

304 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTTFS4H05NTWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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