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NTMTS0D7N06CTXG

Onsemi

NTMTS0D7N06CTXG by Onsemi

NTMTS0D7N06CTXG by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 900A IDM. Ideal for applications requiring high power dissipation, such as automotive systems or industrial equipment. Features include a built-in diode, small outline package style, and -55 to 175 °C operating temperature range.

Median Price

$3.057

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,007 parts In-Stock

1+ parts

$6.960

100+ parts

$3.485

1k+ parts

-

10k+ parts

$1.727

1,007

$6.960

$3.485

-

$1.727

Farnell

UK . 108,271 parts In-Stock

1+ parts

-

100+ parts

$3.851

1k+ parts

-

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108,271

-

$3.851

-

-

Rochester

USA . 107,271 parts In-Stock

1+ parts

-

100+ parts

$1.720

1k+ parts

$1.540

10k+ parts

$1.450

107,271

-

$1.720

$1.540

$1.450

Verical

USA . 69,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.263

10k+ parts

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69,791

-

-

$2.263

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 284 parts In-Stock

1+ parts

$3.002

100+ parts

-

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284

$3.002

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$9.979

100+ parts

-

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10

$9.979

-

-

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Vyrian

USA . 73,709 parts In-Stock

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-

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73,709

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,122 parts In-Stock

1+ parts

$1.010

100+ parts

-

1k+ parts

-

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1,122

$1.010

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-

-

Ampacity Inc.

Singapore . 73,790 parts In-Stock

1+ parts

$2.520

100+ parts

-

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73,790

$2.520

-

-

-

Corphita

USA . 1,134 parts In-Stock

1+ parts

$2.844

100+ parts

-

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1,134

$2.844

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Corohmni

South Africa . 112 parts In-Stock

1+ parts

$2.968

100+ parts

-

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112

$2.968

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$9.979

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-

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2,000

$9.979

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Microchip USA

USA . 8,917 parts In-Stock

1+ parts

$21.882

100+ parts

-

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8,917

$21.882

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Continental Prestige Electronics

USA . 94,806 parts In-Stock

1+ parts

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100+ parts

$3.920

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94,806

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$3.920

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QUARKTWIN TECHNOLOGY LTD

USA . 9,569 parts In-Stock

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9,569

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TANS Electronics

Latvia . 7,250 parts In-Stock

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7,250

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SupplyDigital Components

Austria . 6,444 parts In-Stock

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6,444

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Kulean Microsystems

USA . 4,427 parts In-Stock

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4,427

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Problanco Electronics

Mexico . 3,499 parts In-Stock

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3,499

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Perfect Parts

USA . 3,338 parts In-Stock

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3,338

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Lixinc

USA . 3,304 parts In-Stock

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3,304

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 589 parts In-Stock

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589

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UHIMA Technologies

Türkiye . 256 parts In-Stock

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256

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Overview

Discover the power and reliability of the NTMTS0D7N06CTXG Power Field Effect Transistor by Onsemi. Manufactured with top-tier quality and cutting-edge technology, this N-CHANNEL FET offers unparalleled performance and efficiency for a wide range of applications. With a built-in diode and high breakdown voltage, this transistor ensures stable and consistent operation even in demanding conditions. Trust Onsemi's expertise and choose the NTMTS0D7N06CTXG for superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Offers efficient switching performance and lower on-state resistance, making it suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor package.

Maximum Pulsed Drain Current (IDM): 900 A

This high current rating allows the transistor to handle sudden surges in power, making it reliable under heavy load conditions.

Avalanche Energy Rating (EAS): 1754 mJ

Provides protection against voltage spikes and transient events, improving the overall robustness of the product.

Maximum Power Dissipation (Abs): 294.6 W

Ability to dissipate high amounts of power without overheating, ensuring stable operation in demanding applications.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without compromising performance, suitable for industrial or automotive applications.

Maximum Drain Current (ID): 464 A

Capable of handling high continuous current, making it ideal for power amplifier or switching applications.

Maximum Drain-Source On Resistance: 0.00072 ohm

Low on-state resistance minimizes power loss and heat generation, improving efficiency in power management.

Technical Specifications

Power Field Effect Transistors (FET) NTMTS0D7N06CTXG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1754 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

464 A

Maximum Drain Current (ID):

464 A

Maximum Drain-Source On Resistance:

.00072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

174 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMTS0D7N06CTXG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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