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NTMTS001N06CLTXG

Onsemi

NTMTS001N06CLTXG by Onsemi

NTMTS001N06CLTXG by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 900A IDM. Ideal for applications requiring high power dissipation, such as automotive systems and industrial equipment. Features include a built-in diode, small outline package style, and -55 to 175 °C operating temperature range.

Median Price

$7.688

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Verical

USA . 90 parts In-Stock

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RS (Exports)

UK . 44 parts In-Stock

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$7.688

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$6.837

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$7.502

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Digiode

USA . 2,276 parts In-Stock

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Vyrian

USA . 1,950 parts In-Stock

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Extreme Components

USA . 494 parts In-Stock

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NexGen Digital

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,440 parts In-Stock

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$1.330

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$1.330

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Ampacity Inc.

Singapore . 44 parts In-Stock

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$6.530

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44

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Semicontronic

India . 44 parts In-Stock

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$6.530

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$6.367

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$6.334

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$6.334

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Corohmni

South Africa . 422 parts In-Stock

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$7.352

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Continental Prestige Electronics

USA . 4,688 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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AZTECH Wire

Italy . 385 parts In-Stock

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$8.044

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Microchip USA

USA . 9,465 parts In-Stock

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$19.087

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iodParts Technologies Inc.

India . 5,645 parts In-Stock

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Lixinc

USA . 5,574 parts In-Stock

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Argo Parts USA

USA . 2,853 parts In-Stock

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Kulean Microsystems

USA . 2,469 parts In-Stock

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Corphita

USA . 1,933 parts In-Stock

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SupplyDigital Components

Austria . 1,618 parts In-Stock

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UHIMA Technologies

Türkiye . 960 parts In-Stock

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TANS Electronics

Latvia . 583 parts In-Stock

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Problanco Electronics

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Overview

Experience top-notch performance with the NTMTS001N06CLTXG by Onsemi. Crafted by a trusted manufacturer, this Power Field Effect Transistor (FET) offers unparalleled reliability and efficiency. With a single configuration and built-in diode, it's perfect for a wide range of applications. From power supplies to motor control, this N-channel transistor delivers exceptional value and benefits to customers. Enhance your projects with the NTMTS001N06CLTXG and experience the advantages of quality engineering at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, provides protection to the components inside

Polarity or Channel Type: N-CHANNEL

Allows for efficient electron flow and low impedance in the channel

Operating Mode: ENHANCEMENT MODE

Enhances the transistor's conductivity when a certain voltage is applied, improving efficiency

Maximum Power Dissipation (Abs): 244 W

Capable of dissipating high power levels without getting damaged

Maximum Operating Temperature: 175 °C

Can operate efficiently in high temperature environments

Maximum Drain Current (ID): 398.2 A

Allows for high current flow, suitable for power applications

Maximum Drain-Source On Resistance: 0.00105 ohm

Low resistance ensures efficient power transfer and minimal power loss

Terminal Position: DUAL

Provides flexibility in circuit design and connection options

Technical Specifications

Power Field Effect Transistors (FET) NTMTS001N06CLTXG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

887 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

398.2 A

Maximum Drain Current (ID):

398.2 A

Maximum Drain-Source On Resistance:

.00105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

130 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTMTS001N06CLTXG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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