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NTMT190N65S3H

Onsemi

NTMT190N65S3H by Onsemi

NTMT190N65S3H by Onsemi is a N-CHANNEL FET with 650V DS breakdown voltage and 45A IDM. Ideal for switching applications, it operates in enhancement mode with 0.19 ohm RDS(on) and 129W power dissipation.

Median Price

$4.418

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 3,000 parts In-Stock

1+ parts

$3.869

100+ parts

$2.378

1k+ parts

-

10k+ parts

-

3,000

$3.869

$2.378

-

-

Arrow

USA . 3,000 parts In-Stock

1+ parts

$4.417

100+ parts

$2.768

1k+ parts

$2.325

10k+ parts

-

3,000

$4.417

$2.768

$2.325

-

Mouser Electronics

USA . 6,000 parts In-Stock

1+ parts

$4.420

100+ parts

$3.110

1k+ parts

$2.540

10k+ parts

$2.500

6,000

$4.420

$3.110

$2.540

$2.500

Element14

Singapore . 3,000 parts In-Stock

1+ parts

$5.102

100+ parts

$3.463

1k+ parts

$2.937

10k+ parts

-

3,000

$5.102

$3.463

$2.937

-

Newark

USA . 3,000 parts In-Stock

1+ parts

$5.460

100+ parts

$3.080

1k+ parts

$2.590

10k+ parts

-

3,000

$5.460

$3.080

$2.590

-

Chip1Stop

Japan . 2,810 parts In-Stock

1+ parts

$16.600

100+ parts

$7.450

1k+ parts

$4.790

10k+ parts

-

2,810

$16.600

$7.450

$4.790

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Rochester

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$2.420

1k+ parts

$2.170

10k+ parts

$2.040

18,000

-

$2.420

$2.170

$2.040

DigiKey

USA . 5,699 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.590

10k+ parts

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5,699

-

-

$2.590

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Flip Electronics (Authorized)

USA . 5,699 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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5,699

-

-

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Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$2.768

1k+ parts

$2.325

10k+ parts

-

3,000

-

$2.768

$2.325

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RS (Exports)

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

$4.808

1k+ parts

$3.959

10k+ parts

-

3,000

-

$4.808

$3.959

-

Distributors (In-Stock)

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Digiode

USA . 2,176 parts In-Stock

1+ parts

$2.565

100+ parts

-

1k+ parts

-

10k+ parts

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2,176

$2.565

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Vyrian

USA . 1,884 parts In-Stock

1+ parts

$2.590

100+ parts

-

1k+ parts

-

10k+ parts

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1,884

$2.590

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-

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Flip Electronics

USA . 5,699 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,699

-

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Distributors (Availability)

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Corphita

USA . 2,481 parts In-Stock

1+ parts

$2.430

100+ parts

-

1k+ parts

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2,481

$2.430

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-

-

Corohmni

South Africa . 304 parts In-Stock

1+ parts

$2.590

100+ parts

-

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304

$2.590

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Continental Prestige Electronics

USA . 3,000 parts In-Stock

1+ parts

$4.370

100+ parts

$2.960

1k+ parts

$2.300

10k+ parts

-

3,000

$4.370

$2.960

$2.300

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Microchip USA

USA . 9,874 parts In-Stock

1+ parts

$17.788

100+ parts

-

1k+ parts

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10k+ parts

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9,874

$17.788

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Perfect Parts

USA . 12,936 parts In-Stock

1+ parts

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12,936

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QUARKTWIN TECHNOLOGY LTD

USA . 9,797 parts In-Stock

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9,797

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SupplyDigital Components

Austria . 6,572 parts In-Stock

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6,572

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Kulean Microsystems

USA . 5,265 parts In-Stock

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5,265

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GreenTree Electronics

Israel . 2,910 parts In-Stock

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2,910

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Authorized Procurement Solutions

USA . 2,810 parts In-Stock

1+ parts

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2,810

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Problanco Electronics

Mexico . 1,622 parts In-Stock

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1,622

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TANS Electronics

Latvia . 392 parts In-Stock

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392

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UHIMA Technologies

Türkiye . 288 parts In-Stock

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288

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Overview

Discover the NTMT190N65S3H by Onsemi, a high-quality Power Field Effect Transistor designed for switching applications. Manufactured by Onsemi, known for their superior products, this N-CHANNEL transistor offers customers reliability and efficiency. With a maximum power dissipation of 129W and a minimum DS breakdown voltage of 650V, this transistor is perfect for various industrial applications. Experience enhanced performance and durability with the NTMT190N65S3H, making it the ideal choice for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and lower on-resistance compared to P-channel FETs, making this FET a good choice for high efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse polarity, making this FET convenient and efficient for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high frequency performance and fast switching times, making it ideal for power management systems.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving space and enabling automated manufacturing processes.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage of 650V ensures reliable operation and protection against voltage spikes, making this FET suitable for high voltage applications.

Maximum Pulsed Drain Current (IDM): 45 A

With a high pulsed drain current rating, this FET can handle surge currents effectively, making it reliable in applications where sudden high power surges may occur.

Avalanche Energy Rating (EAS): 1.42 mJ

The FET's low avalanche energy rating indicates its ability to withstand energy spikes without breakdown, ensuring long-term reliability in harsh operating conditions.

Maximum Power Dissipation (Abs): 129 W

With a high power dissipation rating of 129W, this FET can handle significant power levels without overheating, making it suitable for high power applications.

Maximum Operating Temperature: 150 °C

The FET's high maximum operating temperature allows for reliable performance in elevated temperature environments, making it versatile for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) NTMT190N65S3H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1.42 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMT190N65S3H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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